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Electroless copper plating compositions and methods for electroless plating copper on substrates

A technology for electroless copper plating and composition, applied in the field of electroless copper plating compositions and for electroless copper plating on substrates, can solve problems such as low maintenance requirements, achieve good through hole wall coverage, reduce operating costs, reduce The effect of consumption

Active Publication Date: 2019-12-24
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the more stable formulation provided by the lower operating temperature results in lower maintenance requirements

Method used

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  • Electroless copper plating compositions and methods for electroless plating copper on substrates
  • Electroless copper plating compositions and methods for electroless plating copper on substrates
  • Electroless copper plating compositions and methods for electroless plating copper on substrates

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0064] Electroless Copper Plating Rates for Electroless Copper Plating Baths Containing Pyridinium Compounds

[0065] Ten (10) electroless copper plating baths were prepared. All ten baths contain the following components:

[0066] 1. 10g / L copper sulfate pentahydrate

[0067] 2. 40g / L Rochelle salt

[0068] 3. 8g / L sodium hydroxide

[0069] 4. 4g / L formaldehyde

[0070] 5. 0.5ppm 2,2'-dithiodisuccinic acid

[0071] 6. Water (surplus)

[0072] The pH of each bath was 13. To nine (9) electroless plating compositions was added one of the following pyridinium compounds in the amounts indicated in Table 1 . Bath 10 was a control in which no pyridinium compound was added.

[0073] Table 1

[0074]

[0075] Each bath was used for copper plating on bare epoxy substrates of NP140 material (South Asia, Taiwan, China). Prior to electroless copper plating, each epoxy substrate was first treated according to the following process:

[0076] (1) Apply conditioner 231 at 40°C f...

example 2

[0088] Example 2 (comparative example)

[0089] Electroless Copper Plating Rates for Electroless Copper Plating Baths Containing Pyridine (Free Nitrogen Base)

[0090] Three (3) electroless copper plating baths were prepared. All three baths include the following components:

[0091] 1. 10g / L copper sulfate pentahydrate

[0092] 2. 40g / L Rochelle salt

[0093] 3. 8g / L sodium hydroxide

[0094] 4. 4g / L formaldehyde

[0095] 5. 0.5ppm 2,2'-dithiodisuccinic acid

[0096] 6. Water (surplus)

[0097] The pH of each bath was 13. Pyridine was added to the baths in an amount of 2.5 ppm (comparative bath 1), 10 ppm (comparative bath 2) or 20 ppm (comparative bath 3).

[0098] Each bath is used to plate copper on epoxy substrates. The epoxy substrate was treated as described in Example 1 in preparation for electroless copper plating. Electroless copper plating was performed at 34°C for 5 minutes. Plating rates were then determined as described in Example 1. The plating rates...

example 3

[0103] Electroless Copper Plating Rates for Electroless Copper Plating Baths Containing Pyridinium Compounds and Guanidine Hydrochloride

[0104] Fourteen (14) electroless copper plating baths were prepared. All fourteen baths include the following components:

[0105] 1. 10g / L copper sulfate pentahydrate

[0106] 2. 40g / L Rochelle salt

[0107] 3. 8g / L sodium hydroxide

[0108] 4. 4g / L formaldehyde

[0109] 5. 0.5ppm 2,2'-dithiodisuccinic acid

[0110] 6. 0.36ppm guanidine hydrochloride

[0111] 7. Water (surplus)

[0112] The pH of each bath was 13. To thirteen (13) electroless plating compositions was added one of the following pyridinium compounds in the amounts indicated in Table 4. Bath 24 was a control in which no pyridinium compound was added.

[0113] Table 4

[0114]

[0115] Each bath is used for copper plating on bare epoxy substrates. Each epoxy substrate was treated as described in Example 1 prior to electroless copper plating. Electroless copper p...

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Abstract

Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperaturesand at high plating rates.

Description

technical field [0001] The present invention relates to an electroless copper plating composition and a method for electroless copper plating on a substrate, wherein the electroless copper plating has a high electroless copper plating rate at low temperature and the electroless copper plating composition is stable. More particularly, the present invention relates to electroless copper plating compositions and methods for electroless copper plating on substrates, wherein the electroless copper plating has a high electroless copper plating rate at low temperatures, and the electroless copper plating compositions are stable, And wherein the electroless copper plating composition contains a pyridinium compound or a salt thereof. Background technique [0002] Electroless copper plating baths are widely used in the metallization industry for depositing copper on various types of substrates. For example, in the manufacture of printed circuit boards, electroless copper baths are us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/1675C23C18/40C23C18/405C23C18/30
Inventor A·M·里夫希茨阿莱比奥P·冈布利M·利普舒兹F·刘C·穆尔泽S·文
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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