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Electroless copper plating solution

A technology of electroless copper plating and plating solution, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as reducing the plating deposition rate

Inactive Publication Date: 2015-02-25
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of tartrate as a complexing agent in the electroless copper bath will reduce the plating deposition rate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3 and comparative example 1-6

[0031]Add the compounds listed in Table 1 to the base bath below to make the test baths. Next, various resin substrates were plated with the above-mentioned test baths, and the obtained test pieces were evaluated. The results are shown in Table 2.

[0032]

Embodiment 4

[0034] Except using the below-mentioned plating bath, the same procedure as in Example 1 was carried out, and the obtained test pieces were evaluated, and the results are shown in Table 2.

[0035]

[0036] Table 1

[0037] Table 1. Amount of each compound added (unit: mg / L)

[0038]

[0039] Table 2

[0040] Table 2. Evaluation results

[0041]

[0042] * Plating without deposition

[0043] overall evaluation

[0044] table 3

[0045] overall evaluation

peel stress

Exterior color

A

high

pretty dark 注1)

[0046] B

high

black

C

Low

shallow 注2)

D

Can't detect

Copper powder chemical precipitation

[0047] Note 1) Quite black means good appearance

[0048] Note 2) Indicates that it has the same brightness as the slot not added

[0049] Resin substrate

[0050] Substrate 1: epoxy resin, surface roughness (Ra) 220-260nm

[0051] Substrate 2: epoxy resin, surface r...

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Abstract

Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

Description

technical field [0001] The invention relates to an electroless copper plating solution, the plating film formed by it has excellent adhesion on the plated object. More particularly, the present invention relates to an electroless copper plating solution that can form a highly viscous plated film even on an object to be plated with a low-roughness surface. Background technique [0002] Electroless copper plating is applied in a wide range of technical fields, such as plating on functional insulating resins during assembly and wiring in the manufacture of high-density printed circuit boards, plating inside through-holes for electrical connection between layers of printed circuit boards, and similar fields. When electroless plating is performed on resin, high adhesion is generally obtained by chemically roughening the surface of the resin and utilizing the so-called anchoring effect (anchor) to improve the adhesion between the resin substrate and the conductive film. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/1633C23C18/38C23C18/40
Inventor 吉田胜宏羽切义幸近藤诚
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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