Electroless copper plating solution

a technology of electroless copper and plating solution, which is applied in the direction of liquid/solution decomposition chemical coating, solid/suspension decomposition chemical coating, coating, etc., can solve the problems of significant waste water treatment problems, difficult to form conductive films having high adhesiveness with resin surfaces, and difficult to roughen resin surfaces. , to achieve the effect of high plating rate, good appearance and high adhesiveness

Inactive Publication Date: 2015-01-22
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]Therefore, the first purpose of the present invention is to provide an electroless copper plating solution that presents high adhesiveness regardless of the roughness (degree of roughness of the surface) of the surface of the resin substrate and is capable of forming a plating film having a good appearance. The second purpose of the present invention is to provide an electroless copper plating solution having a high plating rate even without using EDTA which poses a problem in waste water treatment.

Problems solved by technology

In addition, the high-performance resin materials being used recently as the resin substrate have high chemical resistance and mechanical properties, making it difficult to roughen the resin surface.
Since it is difficult to actualize an anchor effect when forming a conductive film on these low-roughness surfaces, it was extremely difficult to form a conductive film having high adhesiveness with such resin surfaces.
However, EDTA interferes with the neutralization and precipitation of heavy metals and poses a significant problem in waste water treatment.
Nonetheless, the plating deposition speed is known to drop when tartrates are used as complexing agents for electroless copper plating solution.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

examples

[0028]The present invention is explained below based on working examples. However, these examples do not limit the scope of the present invention.

working example 4

[0030]The same procedure as in Working Example 1 was carried out except that the following plating bath was used, and the test piece obtained was evaluated. The results are shown in Table 2.

Plating bathCupric chloride dihydrate8.1 g / L (3 g / L as copper)Guanosine  5 mg / LRochelle salt20 g / LSodium hydroxide10 g / LFormaldehyde (23% aqueous20 mL / L (5.0 g / L as formaldehyde)solution)

Table 1

[0031]

TABLE 1Amounts of each compound added (unit: mg / L)Working ExampleComparative Example1234123456Guanosine1020305——————Guanine—————10————Uric acid——————20———Caffeine———————10——N,N′-————————10—bis(hydroxymethyl)ureaAdenine—————————20

Table 2

[0032]

TABLE 2Evaluation resultsWorking ExampleComparative ExampleEvaluation1234123456PeelSubstrate0.6620.7200.6880.6660.5510.709 0.6600.6020.591*strength1(kN / m)Substrate0.4070.5240.5040.4700.3690.5200.4960.3660.389*2Substrate0.3860.4050.4190.2850.2670.3020.2670.3020.280*3Film—0.520.590.470.64 0.570.710.560.540.51*thickness(μm)Appearance—FairlyFairlyFairlyFairlyLightDar...

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Abstract

Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

Description

FIELD OF THE INVENTION[0001]The present invention relates to an electroless copper plating solution that forms a plating film having excellent adhesiveness with the article being plated. More specifically, it relates to an electroless copper plating solution that makes it possible to form a plating film having high adhesiveness even with an article being plated that has a low-roughness surface.BACKGROUND OF THE INVENTION[0002]Electroless copper plating is used in a wide range of technical fields, such as plating on a functional insulating resin during build up and wiring formation in the manufacture of high-density printed circuit boards, plating inside the through holes for electrical connection between the layers of printed circuit boards, and the like. When electroless plating is performed on a resin, high adhesiveness is generally achieved by chemically roughening the resin surface and utilizing the so-called anchor (anchor) effect to improve the adhesiveness between the resin s...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23C18/40C23C18/16
CPCC23C18/1633C23C18/40C23C18/38
Inventor YOSHIDA, KATSUHIROHAKIRI, YOSHIYUKIKONDO, MAKATO
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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