Plating solution and method for producing plated product
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[0038]Next, the present invention will be described further in detail by way of examples. However, the present invention is not limited to these examples.
(Summary of the Present Invention: Difference from Conventional Trivalent Chromium Plating)
[0039]FIG. 1 shows the relationship between current density and plating thickness in hexavalent chromium plating and trivalent chromium plating disclosed in general literatures or the like. It is understood from this graph that it is difficult to exert throwing power in conventional trivalent chromium plating since the slope of the straight line that shows the relationship between current density and plating thickness rapidly increases at a current density of about 5 A / dm2. Further, it is understood from this graph that it is difficult to perform plating at a current density of 5 A / dm2 or less and to perform plating with excellent covering power in conventional trivalent chromium plating.
[0040]In contrast, in the case of using the plating sol...
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