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Tin or tin-alloy plating liquid, bump forming method, and circuit board production method

a technology of tin or tin alloy and plating liquid, which is applied in the manufacture of printed circuits, semiconductor/solid-state devices, and semiconductor/solid-state devices, etc. it can solve the problems of not achieving uniform bump height and 4 plating liquids for substrates, and achieve uniform bump height and plating. good, the effect of suppressing the precipitation of snions

Inactive Publication Date: 2021-02-11
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0030]In the tin or tin-alloy plating liquid according to the first aspect of the present invention, the surfactants (C1 and C2) have specific nonionic structure in which the number n of polyoxypropylene alkyl groups and the number m of polyoxyethylene groups in Formulas (1) and (2) are set to be in the predetermined ranges, respectively. Accordingly, at the time of plating, it is possible to suppress precipitation of Sn ions and perform good plating on a surface to be plated. In particular, according to this plating liquid, in a case of a pattern having different bump diameters, although the bump diameter is large or small, the via filling property for vias on a substrate are excellent, and heights of formed bumps become uniform. It is considered that this is because the polarization resistance increases.
[0031]In the tin or tin-alloy plating liquid according to the second aspect of the present invention, two or more selected from a surfactant other than the two surfactants (C1 and C2), an antioxidant, and an alcohol having 1 to 3 carbon atoms are further contained; and thereby, the following effects are exhibited. The surfactant other than the two surfactants (C1 and C2) exhibits effects such as stabilization of the plating liquid, improvement of solubility, and the like. In addition, the antioxidant prevents the oxidation of a soluble stannous salt to a stannic salt. Further, the alcohol exhibits an effect of improving the solubility of the surfactant.
[0032]In the method according to the third aspect of the present invention, the tin or tin-alloy plating deposition layers are formed on a substrate using the tin or tin-alloy plating liquid according to the first or second aspect, and next, a reflow process is performed to form bumps. Accordingly, it is possible to form bumps having a uniform height even in a pattern having different bump diameters.
[0033]In the method according to the fourth aspect of the present invention, a circuit board is produced using the bumps formed by the method according to the third aspect. Accordingly, a highly reliable semiconductor device without electrical connection failure can be produced.

Problems solved by technology

However, the plating liquids for substrates in Patent Documents 1 to 4 do not aim at achieving bump height uniformity.

Method used

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  • Tin or tin-alloy plating liquid, bump forming method, and circuit board production method
  • Tin or tin-alloy plating liquid, bump forming method, and circuit board production method
  • Tin or tin-alloy plating liquid, bump forming method, and circuit board production method

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0075]Methanesulfonic acid as a free acid, hydroquinone as an antioxidant, 1-naphthaldehyde as a leveling agent (D-1), methacrylic acid as a leveling agent (D-2) were mixed with a Sn methanesulfonate aqueous solution to obtain a homogeneous solution. Then, as a surfactant, the above No. C1-6 polyoxyethylene alkyl ether (mass average molecular weight: 500, carbon number in R in Formula (1): 13, number m of polyoxyethylene (EO) groups: 6, and number n of polyoxypropylene (PO) groups: 0), the above No. C2-2 condensate of polyoxyethylene and polyoxypropylene alkyl ether (mass average molecular weight: 530, carbon number in R in Formula (2): 9, number m of polyoxyethylene (EO) groups: 6, and number n of polyoxypropylene (PO) groups: 2) were added. Ion-exchanged water was finally added to initially make-up a Sn plating liquid having the following composition. The Sn methanesulfonate aqueous solution was prepared by electrolyzing a metal Sn plate in a methanesulfonic acid aqueous solution....

examples 3 to 5 , 7 to 9 , 11 , 12

Examples 3 to 5, 7 to 9, 11, 12, and 14 and Comparative Examples 1, 2, 4, 5, 7, 9, 10, 12, 13, 15, 16

[0085]In Examples 3 to 5, 7 to 9, 11, 12, and 14 and Comparative Examples 1, 2, 4, 5, 7, 9, 10, 12, 13, 15, and 16, as the nonionic surfactant (C1) and the nonionic surfactant (C2), the surfactants having the properties shown in Tables 1 and 2 were used and selected as shown in Tables 3 and 4. Except for this, in the same manner as in Example 1, Sn plating liquids of Examples 3 to 5, 7 to 9, 11, 12, and 14 and Comparative Examples 1, 2, 4, 5, 7, 9, 10, 12, 13, 15, and 16 were initially made-up.

Initial Make-Up of SnAg Plating Liquid

example 2

[0086]Methanesulfonic acid as a free acid, catechol as an antioxidant, benzaldehyde as the leveling agent (D-1), methyl methacrylic acid as the leveling agent (D-2) were mixed with the Sn methanesulfonate aqueous solution to dissolve. Further, an Ag methanesulfonate liquid was added and mixed. A homogeneous solution was obtained by mixing. Then, as a surfactant, the above No. C1-6 condensate of polyoxyethylene and polyoxypropylene alkyl ether (mass average molecular weight: 500, carbon number in R in Formula (1): 13, number m of polyoxyethylene (EO) groups: 6, and number n of polyoxypropylene (PO) groups: 0), the above No. C2-3 condensate of polyoxyethylene and polyoxypropylene alkyl ether (mass average molecular weight: 650, carbon number in R in Formula (2): 13, number m of polyoxyethylene (EO) groups: 8, and number n of polyoxypropylene (PO) groups: 2) were added. Ion-exchanged water was finally added to initially make-up a SnAg plating liquid having the following composition. Th...

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Abstract

This tin or tin-alloy plating liquid contains (A) a soluble salt including at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) an additive, wherein the surfactant is a compound (C1) represented by Formula (1) and / or a compound (C2) represented by Formula (2).In Formulas (1) and (2), R is an alkyl group having 7 to 13 carbon atoms, m is 5 to 11, n is 1 to 3, and m and n are different from each other.

Description

TECHNICAL FIELD[0001]The present invention relates to a tin or tin-alloy plating liquid for producing bumps serving as bump electrodes of tin or a tin alloy on a substrate when mounting a semiconductor integrated circuit chip on a circuit board, a method for forming bumps (a bump forming method) using the same, and a method for producing a circuit board (a circuit board production method). The invention more particularly relates to a tin or tin-alloy plating liquid which has excellent via filling property for vias on a substrate even in a pattern having different bump diameters or bump pitches, and which can form bumps having a uniform height.[0002]The present application claims priority on Japanese Patent Application No. 2018-52012 filed on Mar. 20, 2018, Japanese Patent Application No. 2018-57551 filed on Mar. 26, 2018, and Japanese Patent Application No. 2019-40216 filed on Mar. 6, 2019, the contents of which are incorporated herein by reference.BACKGROUND ART[0003]In a circuit b...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D3/32H01L23/00C25D3/60C25D7/12
CPCC25D3/32H01L2224/13155H01L24/13C25D3/60C25D7/12H01L2224/11462H01L2224/11849H01L2224/13109H01L2224/13111H01L2224/13113H01L2224/13118H01L2224/1312H01L2224/13139H01L2224/13147H01L24/11H01L2224/1403C25D5/02C25D7/00C25D5/505C25D7/123H05K3/4007H05K2203/0723H01L2224/0401H01L2224/1147H01L2224/13022H01L2224/2932H01L2224/29318H01L2224/29309H01L2224/29386H01L2224/05647H01L2224/29347H01L2224/29313H01L2224/29355H01L2224/29339H01L2224/29311H01L2224/29294H01L2924/00014H01L2924/013H01L2924/0105H01L2924/01083H01L2924/0541H01L2924/01029H01L2924/058H01L2924/01028H01L2924/0582H01L2924/0103H01L2924/01047H01L2924/01049H01L2924/05432H01L2924/054H01L2924/0581H01L2924/0544H01L2924/057H01L2924/01051H01L2924/0583H01L2924/0542H01L2924/0584H01L2924/053H01L2924/0543
Inventor WATANABE, MAMISUSUKI, KYOKANAKAYA, KIYOTAKA
Owner MITSUBISHI MATERIALS CORP
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