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Manufacturing apparatus for semiconductor device and manufacturing method of semiconductor device

a manufacturing method and semiconductor technology, applied in lighting and heating apparatus, combustible gas coke oven heating, furnaces, etc., can solve the problems of reducing the yield of a semiconductor device, arc-sublimates becoming dust on the substrate surface and in the chamber, and affecting the throughput and the speed decrease directly affects the effect of the foregoing techniqu

Inactive Publication Date: 2012-01-17
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, ARC-sublimates become dust on the substrate surface and in the chamber.
Therefore, a problem arises that reduction in yield of a semiconductor device, etc. is caused.
However, although the cooling speed needs to be sufficiently decreased to suppress the dust caused by sublimates, there is a problem that the decreased speed directly affects the throughput with the foregoing technique.

Method used

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  • Manufacturing apparatus for semiconductor device and manufacturing method of semiconductor device
  • Manufacturing apparatus for semiconductor device and manufacturing method of semiconductor device
  • Manufacturing apparatus for semiconductor device and manufacturing method of semiconductor device

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Embodiment Construction

[0019]Reference will now be made in detail to the present embodiment of the invention, an example of which is illustrated in the accompanying drawing. Wherever possible, the same reference numbers will be used throughout the drawing to refer to the same or like parts.

[0020]FIG. 1 is a conceptual top view illustrating the configuration of a semiconductor manufacturing apparatus of this embodiment of the invention. As illustrated in the figure, the manufacturing apparatus includes a bake chamber 10 for a wafer w having an ARC coating film formed thereon to be baked, a cooling chamber 20 for the wafer w to be cooled, and a connection unit 30 that connects the bake chamber 10 with the cooling chamber 20.

[0021]Located in the bake chamber 10 are a wafer loading gate 11 for loading the wafer w to the bake chamber 10, a carrying arm 12 for the wafer w to be carried, and a bake unit 13 including a heater for the wafer w to be baked. The bake unit 13 is provided with a chamber cover 14 for co...

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Abstract

A manufacturing apparatus for a semiconductor device that includes a bake chamber for a wafer with a coating film formed thereon to be baked at a predetermined temperature, a cooling chamber connected to the bake chamber, a first carrying unit for the baked wafer to be carried in the cooling chamber, a first temperature control unit for the wafer carried by the first carrying unit to be cooled down, and an unloading gate for unloading the wafer cooled down from the cooling chamber.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2006-318385 filed on Nov. 27, 2006, the entire contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a manufacturing apparatus for a semiconductor device and a manufacturing method of a semiconductor device for baking of a substrate on which a coating film such as an anti-reflective coating (ARC) film is formed.[0004]2. Description of the Related Art[0005]In general, a lithography technique is used in a process for forming a pattern on a surface of a semiconductor wafer, a liquid crystal display (LCD) glass substrate, or the like (hereinafter referred to as a “substrate”). Such a pattern formation process generally including a resist film formation step in which a resist is applied onto the surface of a substrate to form a resist f...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): F27B9/02
CPCH01L21/67109H01L21/6715
Inventor KUDO, TOMOYASU
Owner KK TOSHIBA