Unlock instant, AI-driven research and patent intelligence for your innovation.

Oxide-based semiconductor non-linear element having gate electrode electrically connected to source or drain electrode

a non-linear element, oxide-based technology, applied in the field of nonlinear elements, to achieve the effect of large on-state current, small off-state current, and large on-state curren

Inactive Publication Date: 2015-02-10
SEMICON ENERGY LAB CO LTD
View PDF189 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As described above, although a non-linear element (e.g., a diode) in which silicon carbide is used is expected to have high withstand voltage and small reverse saturation current, there are many problems in manufacturing and achieving such an element.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

embodiment 1

[0025]In this embodiment, an example of a structure of a diode which is one embodiment of the present invention will be described with reference to FIGS. 1A and 1B. The diode which is described in this embodiment can be obtained by connecting a source or a drain of a field effect transistor, for example, a thin film transistor to a gate thereof.

[0026]In the diode illustrated in FIGS. 1A and 1B, a wiring 125 is connected to a third electrode 113, a third electrode 115, and a second electrode 109, and the second electrode 109 is connected to a first electrode 105 through an oxide semiconductor film 107. The first electrode 105 is connected to a wiring 131.

[0027]FIG. 1A is a top view of a diode-connected thin film transistor 133. FIG. 1B is a cross-sectional view along dashed-and-dotted line A-B in FIG. 1A.

[0028]As illustrated in FIG. 1B, the first electrode 105, the oxide semiconductor film 107, and the second electrode 109 are stacked over an insulating film 103 which is formed over ...

embodiment 2

[0053]In this embodiment, an example of a diode having a structure different from that in Embodiment 1 will be described with reference to FIGS. 3A and 3B. The diode which is described in this embodiment can be obtained by connecting a source or a drain of a field effect transistor, for example, a thin film transistor to a gate thereof.

[0054]In the diode illustrated in FIGS. 3A and 3B, a wiring 131 is connected to a first electrode 105 and a third electrode 113, and a wiring 132 is connected to a first electrode 106 and a third electrode 115. The first electrode 105 and the first electrode 106 are connected to a second electrode 109 through an oxide semiconductor film 107. The second electrode 109 is connected to a wiring 129.

[0055]FIG. 3A is a top view of diode-connected thin film transistors 141 and 143. FIG. 3B is a cross-sectional view along dashed-and-dotted line A-B in FIG. 3A.

[0056]As illustrated in FIG. 3B, the first electrode 105 and the first electrode 106, the oxide semic...

embodiment 3

[0067]In this embodiment, an example of a diode, which is an embodiment of the present invention and has a structure different from those in Embodiments 1 and 2, will be described with reference to FIGS. 5A and 5B. The diode which is described in this embodiment can be obtained by connecting a source or a drain of a field effect transistor, for example, a thin film transistor to a gate thereof.

[0068]In the diode illustrated in FIGS. 5A and 5B, a wiring 131 is connected to a first electrode 105 and a third electrode 113. The first electrode 105 is connected to a second electrode 109 through an oxide semiconductor film 107. The second electrode 109 is connected to a wiring 129.

[0069]FIG. 5A is a top view of a diode-connected thin film transistor 145. FIG. 5B is a cross-sectional view along dashed-and-dotted line A-B in FIG. 5A.

[0070]As illustrated in FIG. 5B, the first electrode 105, the oxide semiconductor film 107, and the second electrode 109 are stacked over an insulating film 103...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A non-linear element (e.g., a diode) with small reverse saturation current is provided. A non-linear element includes a first electrode provided over a substrate, an oxide semiconductor film provided on and in contact with the first electrode, a second electrode provided on and in contact with the oxide semiconductor film, a gate insulating film covering the first electrode, the oxide semiconductor film, and the second electrode, and a third electrode provided in contact with the gate insulating film and adjacent to a side surface of the oxide semiconductor film with the gate insulating film interposed therebetween or a third electrode provided in contact with the gate insulating film and surrounding the second electrode. The third electrode is connected to the first electrode or the second electrode.

Description

TECHNICAL FIELD[0001]The present invention relates to a non-linear element including an oxide semiconductor and a semiconductor device including the non-linear element, such as a display device. Furthermore, the present invention relates to an electronic device including the semiconductor device.BACKGROUND ART[0002]Among semiconductor devices, diodes are required to have high withstand voltage, small reverse saturation current, and the like. In order to meet such a requirement, a diode in which silicon carbide (SiC) is used has been researched. Silicon carbide used as a semiconductor material has a width of a forbidden band of 3 eV or more, excellent controllability of electric conductivity at high temperature, and is more resistant to dielectric breakdown than silicon. Therefore, silicon carbide is expected to be applied to a diode in which reverse saturation current is small and withstand voltage is high. For example, a Schottky barrier diode in which silicon carbide is used and r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(United States)
IPC IPC(8): H01L29/786H01L27/12H01L29/739H01L29/22H01L29/423
CPCH01L29/42392H01L27/1225H01L29/7869H01L29/78642H01L29/7391H01L29/22H01L29/78648
Inventor YAMAZAKI, SHUNPEI
Owner SEMICON ENERGY LAB CO LTD