Package structure and method for manufacturing thereof
a technology for electronic devices and packaging, applied in semiconductor devices, semiconductor/solid-state device details, electrical devices, etc., can solve the problems of reducing the performance of the general electronic device, affecting the performance of the electronic device directly, and t-contact degradation, so as to enhance the tolerance and reliability of the electronic device, and reduce the degradation of the electronic devi
Active Publication Date: 2015-03-10
XINTEC INC
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- Application Information
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Benefits of technology
The solution effectively prevents moisture from entering the package structure, thereby enhancing the tolerance and reliability of electronic devices by ensuring the second side end of the conductive layer is completely covered, reducing degradation.
Problems solved by technology
Therefore, the reliability of the packaging of the electronic components directly affects the performance of electronic devices.
The moisture from the surrounding may enter into the electronic device package structure along the second side end of the conductive layer, causing the degradation of the T-contact, or even decreasing the performance of the general electronic device.
Method used
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[0020]The embodiments of the transparent conductive structure and a method for manufacturing the same of the present disclosure are discussed in detail below, but not limited the scope of the present disclosure. The same symbols or numbers are used to the same or similar portion in the drawings or the description. And the applications of the present disclosure are not limited by the following embodiments and examples which the person in the art can apply in the related field.
[0021]The singular forms “a,”“an” and “the” used herein include plural referents unless the context clearly dictates otherwise. Therefore, reference to, for example, a metal layer includes embodiments having two or more such metal layers, unless the context clearly indicates otherwise. Reference throughout this specification to “one embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure...
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The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, a second passivation layer, and a solder ball. The conductive layer has a first side end and a second side end, and the solder ball is positioned on the first side end of the conductive layer. The second passivation layer contacts with both the upper surface and the sidewall of the second side end of the conductive layer, and the first passivation layer contacts with the lower surface of the second side end of the conductive layer, so as to completely encapsulate the second end of the conductive layer. The electronic device package accordingly prevents the moisture penetration and to enhance the reliability of the electronic device.
Description
[0001]This application claims priority to U.S. provisional Application Ser. No. 61 / 751,381, filed Jan. 11, 2013, which is herein incorporated by reference.BACKGROUND[0002]1. Technical Field[0003]The present disclosure relates to an electronic device package structure, and more particularly, to an electronic component package structure isolating moisture and a method for manufacturing the same.[0004]2. Description of Related Art[0005]In the manufacturing process of electronic components, the electronic components require a packaging operation for use in various applications such as computers, mobiles or digital camera. Therefore, the reliability of the packaging of the electronic components directly affects the performance of electronic devices.[0006]FIG. 1A is a schematic cross-sectional view of a general electronic device package structure 100a. In FIG. 1A, an electronic chip 110a is positioned on a substrate 120a, and electrically connected to a bonding pad 130a. The bonding pad 1...
Claims
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IPC IPC(8): H01L23/482H01L21/56H01L21/768H01L23/31
CPCH01L21/76885H01L2924/0002H01L23/3114H01L23/3171H01L21/561H01L2224/02371H01L24/94H01L24/97H01L2224/02372H01L2224/13024H01L2224/131H01L2224/32225H01L2224/73253H01L2224/94H01L2224/97H01L2924/14H01L2924/1461H01L2224/83H01L2224/11H01L2224/03H01L2924/014
Inventor CHUNG, MING-CHUNG
Owner XINTEC INC