Compliant dielectric layer for semiconductor device
a dielectric layer and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device details, electrical apparatus, etc., can solve problems such as circuit damage, die and interposer size limitation, and delamination
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example ic package embodiments
3. Example IC Package Embodiments
[0033]In embodiments, a semiconductor device is formed that may be included in an integrated circuit (IC) package. The semiconductor device includes one or more through-silicon vias through the semiconductor device to route signals through the semiconductor device. The semiconductor device further includes at least one compliant dielectric layer to provide compliance or “flex” during heating / cooling, which reduces package damage / failures that may otherwise occur due to the resulting expansion or contraction. The semiconductor device may be an interposer incorporated into an IC package and used to route signals from an attached die to solder balls / bumps of the semiconductor device, and / or the semiconductor device may be an IC package in itself by including active integrated circuits in the semiconductor device.
[0034]Such a semiconductor device may be configured in various ways to include a compliant dielectric material, in embodiments. For instance, F...
example assembly embodiments
5. Example Assembly Embodiments
[0056]Semiconductor devices may be configured and assembled in various ways, according to embodiments. Turning now to FIG. 8, a flowchart providing example steps for assembling an integrated circuit (IC) package with a compliant dielectric layer is shown. Semiconductor device 100 of FIG. 1, semiconductor device 400 of FIG. 2, semiconductor device 600 of FIG. 6, semiconductor device 700 of FIG. 7, and / or any of their respective components / layers may be assembled in accordance with flowchart 800, in embodiments. Other structural and operational embodiments will be apparent to persons skilled in the relevant art(s) based on the discussion regarding flowchart 800.
[0057]The exemplary steps of flowchart 800 are described with respect to the semiconductor device shown in FIGS. 9-17, in various states of assembly. For instance, FIGS. 9-17 respectively show semiconductor device structures 900-1700 at intermediate states of assembly, while FIG. 1 shows a complet...
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Abstract
Description
Claims
Application Information
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