Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semi-conductive roller

A semi-conductive, low-hardness technology, used in circuits, electrical components, electrographics, etc., can solve problems such as difficult surface roughness, uneven thickness of the coating layer, and achieve the effect of avoiding scorch

Active Publication Date: 2007-12-12
SUMITOMO RIKO CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the intermediate layer or the surface layer is formed by a coating operation, the thickness of the coating layer is not uniform for each roll, making it difficult to control the surface roughness as desired

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semi-conductive roller

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0051] In order to further clarify the present invention, some embodiments of the present invention will be described. Of course, the details of these examples and the foregoing description do not limit the invention.

[0052] In order to obtain the semiconductive roller with the structure shown in Figure 1, prepare conductive silicone rubber (X34-264A / B, constructed from Shin-etsu Chemicals, Co., Ltd, Japan) as the material of low hardness base (14), and prepare The 13 kinds of materials forming each coating layer (16) respectively have the corresponding compositions listed in the following Tables 1-3 (ie Examples A-M). Each of these materials for the coating layer was dissolved in methyl ethyl ketone to provide respective coating liquids having predetermined viscosities (about 10 mPa·s).

[0053] Table 1

[0054] Example

A

B

C

D

E

contain

quantity

[

Heavy...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
thicknessaaaaaaaaaa
hardnessaaaaaaaaaa
Login to View More

Abstract

A semi-conductive roll including a shaft, a low-hardness base layer formed on an outer circumferential surface of the shaft, and a coating layer formed by coating radially outwardly of the low-hardness base layer, wherein the coating layer is formed such that a rubber material or an elastomer material is crosslinked by at least one resin crosslinking agent.

Description

[0001] This application claims priority from Japanese Patent Application No. 2003-021497 filed on January 30, 2003, the entire contents of which are incorporated herein by reference. technical field [0002] The present invention relates to semiconductive rollers, eg, developer rollers, for use in office automation (OA) machines or equipment such as electrophotographic copiers, printers and telecopiers. Background technique [0003] Semiconductive rollers such as developing rollers and charging rollers are mounted on office automation (OA) machines or equipment such as electrophotographic copiers, printers, and telecopiers. For example, a developing roller is installed so as to be in contact with toner, so that an electrostatic latent image formed on the peripheral surface of a photosensitive drum as an image bearing medium is developed into a visible image. The charging roller is installed on the machine so that it rotates and keeps in contact with the photosensitive drum. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03G15/02F16C13/00G03G15/00B25F5/02G03G15/08
CPCG03G15/0233Y10T428/2933Y10T29/49549
Inventor 加地明彦石原基晴奥田博文大竹康贵
Owner SUMITOMO RIKO CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products