Flexible base palte in use for packing semiconductor, and onload packaging structure

Abstract

The flexible base plate includes flexible insulation film, multiple first lead wires, and at least a second lead wire in circularity. First lead wires and at least a second lead wire are formed on flexible insulation film. The second lead wire is in use for enhancing intensities of lead wires at angular position. In optimization, at least one of second lead wire is arranged on two sides of the first lead wires. The overlapped part between front end of at least one of second lead wire and semiconductor tube core is in L shape, U shape or Y shape.

Description

technical field [0001] The invention relates to a flexible substrate used for semiconductor packaging, in particular to a flexible substrate for avoiding lead breakage. Background technique [0002] In the field of packaging of integrated circuit chips, using a flexible substrate as a package carrier is one of the common ways at present, wherein the tape carrier package uses a flexible carrier tape with device holes and multiple leads as a chip carrier. [0003] see figure 1 and figure 2 , figure 1 is a sectional view showing the structure of a known tape carrier package. figure 2 is a schematic top view of a known tape carrier package structure. The following will explain how to make figure 1 as well as figure 2 Shown is the Tape Loader Package 2 method. [0004] First, a semiconductor die 10 having a plurality of gold bumps 12 is provided. Next, the semiconductor die 10 is placed in the device hole 24 of the flexible carrier tape. The flexible carrier tape incl...

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Problems solved by technology

[0006] However, if figure 1 As shown, when bonding the inner leads 26 and the gold bumps 12, these inner leads 26 are easily bent and deformed due to the influence of pressure and high temperature, and the stress is particularly concentrated on the outermost inner leads 26.

In the absence of effective support, the inner lead 26 of the outermost part is easily broken, such as figure 1 25 of the lead wire shown in the break, resulting in interruption of the electrical connection

[0007] Therefore, the present invention provides a flexible substrate for packaging, the flexible substrate according to the present invention can overcome the above-mentioned problem of wire breakage caused by the inner wire bonding process

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