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Detecting method for micromachinery structure, micro electromechanical assembly and microdetecting structure

A kind of technology of micromechanical structure and detection method

Inactive Publication Date: 2008-08-20
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the defects of the existing detection methods of micro-mechanical structures and their micro-detection structures, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time. problem to be solved

Method used

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  • Detecting method for micromachinery structure, micro electromechanical assembly and microdetecting structure
  • Detecting method for micromachinery structure, micro electromechanical assembly and microdetecting structure
  • Detecting method for micromachinery structure, micro electromechanical assembly and microdetecting structure

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no. 1 example

[0106] The first embodiment of the present invention proposes a micro-detection structure of the micro-cantilever type. In addition to using a thin film layer to cover the sacrificial layer, a stacked layer is also used to strengthen the boundary strength of the micro-mechanical structure, thereby improving the quantity Measure the accuracy of the resonant frequency of the cantilever beam, and then deduce the mechanical properties of the cantilever beam (ie, the film layer), such as Young's modulus, shear stress constant and Poisson's ratio constant. In addition, according to the difference in geometric dimensions, the cantilever beam with a plate-like appearance can be regarded as a cantilever plate.

[0107] see image 3 Shown is a schematic cross-sectional view of a micro-detection structure in the form of a micro-cantilever beam according to a preferred embodiment of the present invention. The micro-detection structure 300 of the preferred embodiment of the present invent...

no. 2 example

[0114] The second embodiment of the present invention proposes a micro-detection structure without boundary beams, which mainly uses multiple flexible structures (such as bending beams) to replace the existing conventional multiple support beams (straight beams) To connect to the detection beam, and use the low torsional rigidity of the flexible structure itself, so that the micro-detection structure can better simulate the situation of no boundary beam, so the accuracy of measuring the resonant frequency of the detection beam can be improved, and then can be Deduce the mechanical properties of the detection beam (ie, the film layer), such as Young's modulus, shear stress constant and Poisson's ratio constant, etc. In the second embodiment, the flexible structure is represented by the bending beam, but it is not limited to the bending beam, and other flexible structures that can reduce the torsional rigidity are acceptable.

[0115] Please refer to FIG. 7A , which is a top vie...

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Abstract

A test method for micromechanical structure includes such steps as generating a micro test structure on the substrate of micromechanical structure to make its part to be tested is formed by a film layer, vibrating said part while measuring its resonance frequency, and deriving its mechanical propertly to obtain the mechanical performance of the film layer. Said micro test structure has cantilever beam, non-boundary beam and stack layer.

Description

technical field [0001] The present invention relates to a detection method and its structure in a metrology detection device, in particular to a detection method of a micro-mechanical structure capable of obtaining the mechanical properties of a film layer of a micro-mechanical structure, a micro-electromechanical component and its A micro-detection structure applied to the detection method. Background technique [0002] Surface-type micro-fabrication process (two-dimensional micro-fabrication process), because it has higher three-dimensional component manufacturing flexibility than body-type micro-fabrication process (three-dimensional micro-fabrication process), therefore, surface micro-fabrication process has become more and more popular in recent years. It has gradually become one of the more popular micro-electro-mechanical systems (Micro-Electro-Mechanical Systems, referred to as MEMS) processing technologies. In the past, there have been many micro-system components m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C5/00B81C99/00
Inventor 蔡欣昌方维伦
Owner DELTA ELECTRONICS INC