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Detection method, micro-electromechanical component and micro-detection structure of micro-mechanical structure

A technology for detecting structures and beams, applied in the direction of microstructure technology, microstructure devices, microstructure devices composed of deformable elements, etc.

Inactive Publication Date: 2011-05-25
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to solve the defects of the existing detection methods of micro-mechanical structures and their micro-detection structures, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time. problem to be solved

Method used

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  • Detection method, micro-electromechanical component and micro-detection structure of micro-mechanical structure
  • Detection method, micro-electromechanical component and micro-detection structure of micro-mechanical structure
  • Detection method, micro-electromechanical component and micro-detection structure of micro-mechanical structure

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no. 1 example

[0103] The first embodiment of the present invention proposes a micro-detection structure of the micro-cantilever type. In addition to using a thin film layer to cover the sacrificial layer, a stacked layer is also used to strengthen the boundary strength of the micro-mechanical structure, thereby improving the quantity Measure the accuracy of the resonant frequency of the cantilever beam, and then deduce the mechanical properties of the cantilever beam (ie, the film layer), such as Young's modulus, shear stress constant and Poisson's ratio constant. In addition, according to the difference in geometric dimensions, the cantilever beam with a plate-like appearance can be regarded as a cantilever plate.

[0104] see image 3 Shown is a schematic cross-sectional view of a micro-detection structure in the form of a micro-cantilever beam according to a preferred embodiment of the present invention. The micro-detection structure 300 of the preferred embodiment of the present invent...

no. 2 example

[0111] The second embodiment of the present invention proposes a micro-detection structure without boundary beams, which mainly uses multiple flexible structures (such as bending beams) to replace the existing conventional multiple support beams (straight beams) To connect to the detection beam, and use the low torsional rigidity of the flexible structure itself, so that the micro-detection structure can better simulate the situation of no boundary beam, so the accuracy of measuring the resonant frequency of the detection beam can be improved, and then can be Deduce the mechanical properties of the detection beam (ie, the film layer), such as Young's modulus, shear stress constant and Poisson's ratio constant, etc. In the second embodiment, the flexible structure is represented by the bending beam, but it is not limited to the bending beam, and other flexible structures that can reduce the torsional rigidity are acceptable.

[0112] Please refer to FIG. 7A , which is a top vie...

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Abstract

The invention relates to a detection method, a micro-electromechanical component and a micro-detection structure of a micro-mechanical structure, suitable for obtaining the mechanical properties of a film layer used by the micro-mechanical structure. The detection method comprises the following steps: firstly, the micro-detection structure is formed on a basal material of the micro-detection structure, wherein a part to be detected on the micro-detection structure is made of the film layer; then, the part to be detected is vibrated, and the resonant frequency of the part to be detected is measured; and the mechanical properties of the part to be detected are derived from the physical dimensions, the density and the resonant frequency of the part to be detected so as to obtain the mechanical properties of the film layer. In addition, the modes of the micro-detection structure comprise a micro-cantilever beam and a borderless beam. The invention is additionally provided with a piling layer on the surface of a structure layer so as to improve the measurement accuracy of the resonant frequency of a cantilever beam and more accurately obtain the mechanical properties of the cantilever beam, i.e. the mechanical properties of the film layer. Furthermore, the prior straight supporting beam is replaced by a flexible structure, such as a folding beam so as to more accurately obtain the mechanical properties of the beam, i.e. the mechanical properties of the film layer.

Description

[0001] This application is the application number 03153764.2, the application date is August 20, 2003, and the divisional application of the Chinese patent application with the invention title "detection method of micro-mechanical structure, micro-electromechanical component and its micro-detection structure". technical field [0002] The present invention relates to a detection method and its structure in a metrology detection device, in particular to a detection method of a micro-mechanical structure capable of obtaining the mechanical properties of a film layer of a micro-mechanical structure, a micro-electromechanical component and its A micro-detection structure applied to the detection method. Background technique [0003] Surface-type micro-fabrication process (two-dimensional micro-fabrication process), because it has higher three-dimensional component manufacturing flexibility than body-type micro-fabrication process (three-dimensional micro-fabrication process), the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01H13/00B81B7/00B81B3/00G01N13/00B81C99/00
Inventor 蔡欣昌方维伦
Owner DELTA ELECTRONICS INC