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Electromigration test apparatus and an electromigration test method

A technology of electromigration and test device, which is applied in the direction of measurement device, analog circuit test, electronic circuit test, etc., to achieve the effect of reducing cost

Inactive Publication Date: 2008-08-20
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This mutual influence will limit the permissible variation range of the influencing parameters (temperature and current density) to be studied, and this limitation is unacceptable

Method used

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  • Electromigration test apparatus and an electromigration test method
  • Electromigration test apparatus and an electromigration test method
  • Electromigration test apparatus and an electromigration test method

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Embodiment Construction

[0033] The following fit figure 1 The embodiment of the present invention will further describe the electromigration testing device.

[0034] The electromigration testing device of the present invention has a wafer (108) with a conductive structure (100) to be tested. The conductive structure (100) to be tested is made of aluminum.

[0035] In addition, the electromigration testing device of the present invention also has a DC power supply (101). The DC power supply (101) is connected together with the conductive structure (100) to be tested. The function of the DC power source (101) is to apply load to the conductive structure. That is to say, the current generated by the DC power supply (101) passes through the conductive structure (100) to accelerate electromigration in the conductive structure (100). Such loading conditions can accelerate electromigration within the electronic component since this direct current increases the current density within the conductive struc...

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PUM

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Abstract

The invention relates to an electromigration test apparatus having a direct-current source 101 and an AC voltage source 102 . Furthermore, it has a circuit 104 having a conductive structure 100 , which is electrically coupled to the direct-current source 101 and the AC voltage source 102 , and a measuring device for measuring an electrical parameter which is indicative of electromigration in the conductive structure. The AC voltage source 102 is set up in such a way that it exposes the conductive structure 100 to an alternating current, independently of a direct current, and thus heats the conductive structure 100 to a predetermined temperature.

Description

technical field [0001] The invention relates to an electromigration testing device and an electromigration testing method. Background technique [0002] As the performance and quality requirements for microelectronic components have been continuously improved in recent years, the testing methods for the reliability of printed circuits have also been paid more and more attention. Electromigration is an effect that can cause damage to microelectronic components. The so-called electromigration refers to the movement of substances inside the printed circuit due to the action of electric current. This material flows in the same direction as the electrons flow. This is because the flow of electrons creates a so-called electron wind, which drags the lattice atoms of the printed circuit material along with it. Such material movement has the potential to cause various types of damage to microelectronic components. One possible damage is, for example, the formation of so-called "v...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/316G01R31/02G01R31/26G01R31/28H01L21/66
CPCG01R31/2853G01R31/2858G01R31/2648
Inventor J·冯哈根
Owner INFINEON TECH AG