Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dispensation of controlled quantities of material onto a substrate

一种基片、数量的技术，应用在对表面涂布液体的装置、涂层、电气元件等方向，能够解决测量装置不灵活、不可能实现材料实时和在线测量、需要靶滴定等问题

Inactive Publication Date: 2008-10-01
ASM ASSEMBLY AUTOMATION LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The disadvantage of this system is that it is not possible to achieve real-time and online measurement of the material when it is delivered due to the need for a separate device
In addition, the measuring device becomes inflexible due to the need to deposit material in a defined area (as shown by the opaque lines on the top and bottom plates of the measuring device)
Another drawback is that with this method only drop material is measured in point form and requires processing of target drops

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dispensation of controlled quantities of material onto a substrate
  • Dispensation of controlled quantities of material onto a substrate
  • Dispensation of controlled quantities of material onto a substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] According to a preferred embodiment of the present invention, figure 1 The delivery system 12 of the device 10 , the observation system 14 incorporating the image capture system 28 , and the interconnection of the measurement system and the compensation system 16 are shown. Dosing system 12 comprises dispensers 20, 21 adapted to dispense material 22, 23, a driver 56 that drives various devices that vary the flow of material 22, 23 from dispensers 20, 21, and a computer control system 54 that responds to The amount of material 22, 23 dispensed by the dispenser is fed back and the amount of material 22, 23 released by the dispenser 20, 21 is varied (if desired). Although two dispensers 20, 21 are described in the preferred embodiment, the invention functions equally well with one or more dispensers with suitable modifications. An objective requirement of using more than one dispenser is that more than one material can be dispensed at approximately the same time if differ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an apparatus and method for dispensing material onto a substrate. The apparatus comprises a dispensing system having a dipenser and a control system adapted to adjust a quantity of material to be dispensed onto the substrate. It also includes an image capturing system adapted to acquire an image of the material that is dispensed onto the substrate, a measuring system to analyze the image and measure the quantity of material dispensed, and a compensation system adapted to provide a correction signal to the control system to vary the quantity of material dispensed.

Description

technical field [0001] The present invention relates to a method and apparatus for depositing a quantity of material, such as an adhesive, onto a substrate such as a printed circuit board. In particular, the amount of material deposited on the substrate can be controlled so that the amount of deposited material does not vary beyond a predetermined range. This application is based on the national application number: 03122376.1, a divisional application filed on May 9, 2003, and the title of the invention is "A Method and Device for Putting Materials on a Substrate with Controllable Quantity". Background technique [0002] Various applications exist for depositing precise quantities of material onto the surface of a substrate. Often, in sensitive applications, the amount of released material needs to be closely monitored and controlled. One such application is in the field of semiconductors, where a small amount of adhesive is introduced onto the surface of a substrate where...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/10B05D1/00H05K3/00H01L21/00H01L21/58
CPCH01L24/83H01L21/6715H01L21/67253B05C11/10H01L2224/83H01L21/58B05C11/1005H01L2924/12042H01L2924/00
Inventor 许汉超林永辉麦家仪邹文礼
Owner ASM ASSEMBLY AUTOMATION LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com