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Optical equipment having image pickup element

A technology of optical equipment and imaging components, which is applied in the direction of optics, electrical components, optical components, etc., and can solve problems such as deformation of hard circuit boards, difficult flange rings located at a specified distance, deformation of flange rings, etc.

Inactive Publication Date: 2008-10-01
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the hard circuit board may be slightly deformed by the heat of this soldering
In addition, since the solder itself shrinks from melting to solidification during soldering, the flange gasket may be deformed.
Alternatively, hard circuit boards may also be deformed due to aging changes
Therefore, when assembling, it is difficult to position the above-mentioned flange spacer at a predetermined distance, and the distance of the above-mentioned flange spacer may change with time.

Method used

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  • Optical equipment having image pickup element
  • Optical equipment having image pickup element
  • Optical equipment having image pickup element

Examples

Experimental program
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Effect test

Embodiment Construction

[0024] Hereinafter, various embodiments of the present invention will be described with reference to the drawings.

[0025] figure 1 It is an exploded perspective view of a front plate unit of a digital single-lens reflex camera, which is an optical device (imaging device) according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of an imaging unit of the digital camera. image 3 It is a longitudinal sectional view including the dustproof unit of the imaging unit and the optical axis of the imaging element unit. Figure 4 is image 3 The view from the arrow shows the surrounding area of ​​the lead wire connection part of the imaging element. Among them, FIG. 4 shows the state before soldering of the conductive pattern (pattern).

[0026] In addition, in the following description, the optical axis of the imaging light beam of the digital single-lens reflex camera according to this embodiment is referred to as the optical axis O, and the...

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PUM

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Abstract

In optical equipment, an image pickup element is not electrically connected directly to a hard electric board, but is electrically connected thereto via a flexible printed circuit. Since the image pickup element and the hard electric board are electrically connected via the flexible printed circuit, thermal effect of soldering or effect of deformation of the hard board can be alleviated. Since the flexible printed circuit has flexibility, the image pickup element can easily be positioned at an accurate position at the time of assembly. Also, it can hardly be affected by aged deformation.

Description

technical field [0001] The present invention relates to an optical device (imaging device) having an imaging device, and more particularly to a mounting structure of the imaging device of the optical device. Background technique [0002] Conventionally, several methods of mounting a solid-state imaging element (imaging element) in an optical device are known. For example, Japanese Patent Laid-Open No. 61-259599 discloses a position adjustment device for a solid-state imaging element of a digital camera as an optical device. [0003] The position adjustment device for a solid-state imaging device disclosed in Japanese Patent Application Laid-Open No. 61-259599 above can mount a solid-state imaging device so that its position can be adjusted relative to a chassis. The solid-state imaging element is mounted on a rigid circuit board whose position can be adjusted in a direction perpendicular to the optical axis with a heat dissipation shield plate and an insulating plate interp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03B17/02G02B7/00H04N5/225H05K13/00H05K7/02
CPCH05K1/147H04N5/2253H04N23/54
Inventor 高梨立男宫庄宏明小林素明
Owner OLYMPUS CORP