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Slurry high-ratio hybrid arrangement and hybrid method

A mixing device and high-proportion technology, applied in mixers, chemical instruments and methods, transportation and packaging, etc., can solve the problem that the measurement accuracy cannot meet the technical requirements, shorten the overall supply time, mix fully and evenly, and reduce the stirring time. effect of time

Active Publication Date: 2008-10-29
PLUSTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, there is no need for devices such as liquid level sensors, so that the piping and wiring become simple, and the dilution ratio can be adjusted arbitrarily. Can't meet technical requirements

Method used

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  • Slurry high-ratio hybrid arrangement and hybrid method
  • Slurry high-ratio hybrid arrangement and hybrid method
  • Slurry high-ratio hybrid arrangement and hybrid method

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Embodiment Construction

[0047] The preferred embodiments of the high-ratio slurry mixing device and mixing method of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0048] first as Figure 1 to Figure 3 Shown, the slurry high ratio mixing device of the present invention comprises:

[0049] Stirring box 2, in which the slurry is mixed;

[0050] The deionized water supply pipe 60 is connected with the stirring tank 2 and the deionized water supply source 4, and provides deionized water;

[0051] The deionized water supply main valve 50 is arranged on the deionized water supply pipe 60;

[0052] The deionized water supply auxiliary valve 51 is arranged in parallel with the deionized water supply main valve 50 on the deionized water supply pipe 60;

[0053] Electronic scale 30, is arranged on the lower end of described stirring box 2, is used for measuring the amount of the deionized water and the slurry injected into stirring box 2;

[0054]A ...

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Abstract

The invention relates to a slurry high-ratio mixer, which comprises: one mixing box for mixing slurry; one deionized water feeding tube for supply deionized water; one deionized water feeding main valve on the feeding tube; one deionized water feeding auxiliary valve on the feeding tube to be parallel with main valve; one electric scale on the lower end of mixing box to test the amounts of deionized water and slurry filled into mixing box; several additive feeding tubes connected to the additive source and the mixing box, while the additive source feeds grinding particles and variable additives; several flux control valves on the additive feeding tube; several meters on the additive feeding tubes; one control part for controlling the switch of deionized water feeding main valve and the auxiliary valve based on the value tested by electric scale, to control the switch of flux control valve based on the valve tested by flux meter.

Description

technical field [0001] The invention relates to a high-ratio slurry mixing device and a mixing method, in particular to a high-ratio mixing that can produce and supply slurry with an accurate mixing ratio by using electronic scales and flow control in the CMP process of semiconductor manufacturing engineering. Apparatus and mixing method. Background technique [0002] Usually, in the semiconductor manufacturing process, a prescribed film is first evaporated on the substrate, and the processes of exposure, development, etching, evaporation, etc. are repeated, and planarization technology is required to planarize the required parts on the substrate, so that Structures such as insulating film, metal wiring, isolation (Isolation) and trench (Trench) are formed thereon. [0003] Among the above-mentioned planarization techniques for desired parts on the substrate, there is a chemical mechanical polishing process, which is called CMP (Chemical Mechanical Polishing) process. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01F15/04C09K3/14
CPCB01F23/53B01F23/581B01F35/20
Inventor 韩允元
Owner PLUSTECH