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Substrate processing method and substrate processing apparatus

A substrate processing method and substrate technology, which are applied in cleaning methods and tools, chemical instruments and methods, cleaning methods using liquids, etc., can solve the problems of expensive stripping liquid and increased cost, and achieve the purpose of suppressing increase, suppressing cost, Efficient removal effect

Pending Publication Date: 2020-06-23
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, the peeling liquid that can peel and remove the processing film from the surface of the substrate while keeping the processing film in the state of the object to be removed is relatively expensive.
In the case of supplying the stripping liquid toward the upper surface of the substrate, since the stripping liquid is consumed in a large amount, the cost may increase

Method used

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  • Substrate processing method and substrate processing apparatus
  • Substrate processing method and substrate processing apparatus
  • Substrate processing method and substrate processing apparatus

Examples

Experimental program
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Effect test

no. 1 approach ＞

[0073] figure 1 It is a schematic plan view showing the internal configuration of the substrate processing apparatus 1 according to the first embodiment of the present invention.

[0074] The substrate processing apparatus 1 is a single type apparatus that processes substrates W such as silicon wafers one by one. In this embodiment, the substrate W is a disk-shaped substrate.

[0075] The substrate processing apparatus 1 includes: a plurality of processing units 2, which process substrates W with a fluid; a loading port LP, which is equipped with a storage rack C for accommodating a plurality of substrates W processed by the processing units 2; The substrate W is transported between the port LP and the processing unit 2 ; the controller 3 controls the substrate processing device 1 .

[0076] The transfer robot IR transfers the substrate W between the storage rack C and the transfer robot CR. The transfer robot CR transfers the substrate W between the transfer robot IR and t...

no. 2 approach ＞

[0207] Figure 7 It is a schematic partial cross-sectional view showing a schematic configuration of a processing unit 2P included in the substrate processing apparatus 1P of the second embodiment. refer to Figure 7 , the processing unit 2P of the second embodiment is the same as the processing unit 2 of the first embodiment (refer to figure 2 ) is mainly different in that the processing unit 2P of the second embodiment includes a fourth moving nozzle 14 instead of the opposing member 6 and the central nozzle 11 .

[0208] The fourth moving nozzle 14 is an example of an organic solvent supply unit that supplies an organic solvent to the upper surface of the substrate W. As shown in FIG. In addition, the fourth moving nozzle 14 may be an example of a gas supply unit that supplies gas such as nitrogen gas to the upper surface of the substrate W. As shown in FIG.

[0209] The fourth moving nozzle 14 is moved horizontally and vertically by the fourth nozzle moving unit 35 . ...

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Abstract

The invention provides a substrate processing method and a substrate processing apparatus. The method includes a processing liquid supplying step of supplying a processing liquid having a solute and asolvent to a surface of a substrate, a processing film forming step of solidifying or curing the processing liquid supplied to the surface of the substrate to form, on the surface of the substrate, aprocessing film that holds a removal object present on the surface of the substrate, a peeling step of supplying a peeling liquid forming liquid to the surface of the substrate to put the peeling liquid forming liquid in contact with the processing film and form a peeling liquid, and peeling the processing film, in the state of holding the removal object, from the surface of the substrate by thepeeling liquid, and a removing step of continuing the supply of the peeling liquid forming liquid, after the peeling of the processing film, to wash away and remove the processing film from the surface of the substrate in the state where the removal object is held by the processing film.

Description

technical field [0001] The present invention relates to a substrate processing method and a substrate processing device for processing a substrate. Substrates to be processed include, for example, semiconductor wafers, substrates for liquid crystal display devices, substrates for FPD (Flat Panel Display: Field Emission Display) such as organic EL (Electroluminescence: Electroluminescence) display devices, substrates for optical discs, substrates for magnetic disks, Substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, etc. Background technique [0002] In the manufacturing process of semiconductor devices, in order to remove various contaminants adhering to the substrate, residues such as processing liquids used in previous processes, resists, or various particles (hereinafter, sometimes collectively referred to as "objects to be removed"), Carry out the cleaning process. [0003] In the cleaning process, generally...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67017H01L21/67023H01L21/02041H01L21/02079H01L21/02057H01L21/67051H01L21/67028H01L21/6704H01L21/02052B08B3/10H01L21/02343H01L21/67092H01L21/6715
Inventor 吉田幸史上田大
Owner DAINIPPON SCREEN MTG CO LTD
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