Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Image sensor and method for manufacturing the same

A technology of image sensor and interlayer insulating film, applied in image communication, instrument, electric solid device and other directions, can solve the problems of inability to sense photodiode 12 and interference, etc.

Active Publication Date: 2008-11-26
CROSSTEK CAPITAL
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, if the incident light irradiated onto the photodiodes by the microlens 28 and the color filters 22a, 22b, and 22c is not parallel focused but focused on other optical channels, the photodiodes 12 on the corresponding optical channels cannot sense the light. light or interfere with other adjacent photodiodes 12

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Image sensor and method for manufacturing the same
  • Image sensor and method for manufacturing the same
  • Image sensor and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0019] figure 2 is a cross-sectional view showing the structure of the image sensor according to the present invention, in which main elements of the CMOS image sensor of the present invention directly related to light collection are shown.

[0020] refer to figure 2 , the CMOS image sensor of the present invention includes: a plurality of field insulating films 100 formed on a semiconductor substrate (not shown); at least one photodiode 102, which is a photoactive region formed between the field insulating films 100 multilayer interlayer insulating films 104 and 108, which insulate between the layers of the field insulating film 100 and the top of the photodiode 102, and are stacked in at least two layers so that the density of the upper part is smaller than that of the lower part; and the light shielding layer 106, which is com...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses an image sensor and a method for manufacturing the same which is capable of increasing the light-collection efficiency of a photodiode. The image sensor comprises: at least one photodiode formed on a semiconductor substrate; multilayer interlayer insulating films formed on the photodiode and stacked in at least two layers so that the density of the upper interlayer insulating film becomes lower than that of the lower interlayer insulating film as the multilayer interlayer insulating films proceed upward; a light shield layer and an element-protecting film sequentially stacked on the multilayer interlayer insulating film; color filter arrays and a flattening layer sequentially stacked on the element-protecting film; and microlenses arranged on the positions corresponding to the color filters on the flattening layer. Therefore, the light-collection efficiency of the photodiode can be increased with an increased transmittance of a vertical light reaching to the photodiode by making the multilayer interlayer insulating films have a lower density as they proceed upward to decrease the refraction angle of the incident light penetrated through the microlenses and color filters.

Description

technical field [0001] The invention relates to an image sensor and a manufacturing method thereof, in particular to an image sensor capable of improving the light collection efficiency of a photodiode and a manufacturing method thereof. Background technique [0002] Generally, an image sensor is a semiconductor device that converts an optical image into an electrical signal. Among image sensors, a charge-coupled device (CCD) is a device in which metal-oxide-silicon (hereinafter referred to as MOS) capacitors are placed closely and charge carriers are stored in the MOS capacitors and transferred. Complementary metal-oxide-semiconductor (hereinafter referred to as CMOS) image sensor adopts CMOS technology, which uses control circuits and signal processing circuits as peripheral circuits to form an array of MOS transistors as many as the number of pixels, and adopts a switching method of sequential detection output . MOS transistors are formed in peripheral circuits as many ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N5/335G02B5/20G02B3/00H01L27/00H01L27/14H01L31/00
CPCH01L27/14621H01L27/14685H01L27/14627H01L27/14687H01L27/14632H01L27/14623H01L27/146
Inventor 柳尚旭
Owner CROSSTEK CAPITAL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products