Method for mfg. printed circuitboard

A technology for printed circuit boards and manufacturing methods, applied in the direction of printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as pressing on printed circuit boards, achieve the effect of reducing surface differences and avoiding pool effect

Active Publication Date: 2008-11-26
COMPEQ MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Another object of the present invention is to provide a method of manufacturing a printed circuit board. The technical problem to be solved is to make it produced in a high and low position, so the design of the water retaining roller is not needed, and the existing conventional method can be solved. The problem of impurities being pressed onto the printed circuit board by the water retaining roller in the manufacturing method

Method used

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  • Method for mfg. printed circuitboard
  • Method for mfg. printed circuitboard

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Embodiment Construction

[0036] The specific manufacturing method, steps, features and effects of the manufacturing method of the printed circuit board according to the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0037] Generally speaking, when making printed circuit boards, they will first go through a water washing step to remove the chemicals remaining on the printed circuit board in the previous steps, and then proceed to the desmear process and chemical copper plated through-hole process. (PTH) or shadow (shadow) process, etc., followed by a water washing step to remove the chemicals remaining on the printed circuit board in the previous desmear process, chemical copper plated through hole process or shadow process .

[0038]Please refer to FIG. 1 and FIG. 2 , which are schematic diagrams of a method for manufacturing a printed circuit board according to a preferred embodiment of the present invention. In a preferre...

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Abstract

This invention relates to a productive method of printed circuit board. It contains following steps. At first, to fix a printed circuitboard on a transport device, the printed circuitboard is roughly vertical to a horizontal plane. Then the transporting device makes this board vertically fall down to the medicine solution trough, and the transporting device can make this board move horizontally in this trough; At last, this printed circuit board be vertically up and out of this trough.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a vertically continuous printed circuit board (TRANSFERRING PROCESS FOR MANUFACTURING CIRCUIT BOARD). Background technique [0002] The role of electronic products in the industrial and commercial society has become more and more important, and electronic products generally use printed circuit boards as the medium of signal transmission, so that signals can be transmitted to chips fixed on printed circuit boards through the lines of printed circuit boards or other electronic components. [0003] As far as the manufacturing methods of printed circuit boards are concerned, they can be roughly divided into two methods: horizontal production and vertical production. The so-called horizontal production is to produce the printed circuit board parallel to the horizontal plane. Generally, the printed circuit board is driven forward by the r...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 许博胜陈明哲
Owner COMPEQ MFG
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