Equipment capable of forming homogenous etching liquid film and etching device

Abstract

The invention relates to an apparatus capable of forming homogeneous etching liquid film. It's fitted on sheet type rollers which support a double-side plate. Multi-first etching liquid spray nozzles are arranged under the rollers. This apparatus includes multiple solid rollers, several rows of second etching liquid spray nozzles and several rows of air nozzles. The solid rollers are positioned above the sheet type rollers and on the same plane interparallelly. There are first space and second space between the adjacent solid rollers. The solid rollers contact the double-side plate. So it makes the etching liquid covered on the double-side plate homogeneous. The second etching liquid spray nozzles are arranged above the first space. The air nozzles are arranged above the second space.

Description

technical field [0001] The invention relates to an etching process device, in particular to a device capable of forming a uniform etching liquid film. Background technique [0002] Laminate substrates currently used to manufacture printed circuit boards are formed by laminating multiple double-sided panels, wherein the double-sided panels are formed by alternately laminating an insulating layer and two circuit layers. The method for forming the circuit layer on the upper surface and the lower surface of the insulating layer includes firstly forming a layer of metal copper layer on the upper surface and the lower surface of the insulating layer respectively, and then, using a photolithographic etching process to define the metal copper layer, so as to form a layer on the insulating layer. A circuit layer is formed on the upper surface and the lower surface of the layer respectively. [0003] Figure 1A A schematic top perspective view showing the metal copper layer of an exi...

AI Technical Summary

Problems solved by technology

However, since the roller sheet roller will hinder the flow of the etching solution and spray the etching solution in the same direction at a specific angle, it will also cause uneven thickness of the etching solution film.

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