Equipment capable of forming homogenous etching liquid film and etching device

A technology of etching solution and etching device, which is applied to spray device, removing conductive material by chemical/electrolytic method, etc., can solve the problems of uneven thickness of etching solution film and hindering the flow of etching solution, etc.

Inactive Publication Date: 2004-10-06
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the roller sheet roller will hinder the flow of the etching solution and spray the etching solution in the same direction at a specific angle, it will also cause uneven thickness of the etching solution film.

Method used

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  • Equipment capable of forming homogenous etching liquid film and etching device
  • Equipment capable of forming homogenous etching liquid film and etching device
  • Equipment capable of forming homogenous etching liquid film and etching device

Examples

Experimental program
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Embodiment Construction

[0019] Please refer to Figure 4A 4B, a double-sided panel 204 overlapping the conductive layers 202a, 202b and the insulating layer 200 is subjected to an etching process after the photographic process, so that the conductive layer 202a and the insulating layer 200 on both sides of the insulating layer 200 202b is patterned into a circuit layer. Wherein, the double-sided board 204 is, for example, a hard substrate, and the preferred material of the insulating layer 200 in the hard substrate includes bismaleimide-triazine (bismaleimide-triazine, BT) or glass epoxy resin FR-4 and FR -5, etc., and the material of the conductive layers 202a and 202 is metal copper, for example.

[0020] When carrying out the etching process, the double-sided board 204 is supported by contacting the conductive layer 202 of the double-sided board with a plurality of roller blade rollers 206b, and the roller blade-type rollers 206b are driven by the roller shaft 206a, so that the double board is mo...

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PUM

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Abstract

The invention relates to an apparatus capable of forming homogeneous etching liquid film. It's fitted on sheet type rollers which support a double-side plate. Multi-first etching liquid spray nozzles are arranged under the rollers. This apparatus includes multiple solid rollers, several rows of second etching liquid spray nozzles and several rows of air nozzles. The solid rollers are positioned above the sheet type rollers and on the same plane interparallelly. There are first space and second space between the adjacent solid rollers. The solid rollers contact the double-side plate. So it makes the etching liquid covered on the double-side plate homogeneous. The second etching liquid spray nozzles are arranged above the first space. The air nozzles are arranged above the second space.

Description

technical field [0001] The invention relates to an etching process device, in particular to a device capable of forming a uniform etching liquid film. Background technique [0002] Laminate substrates currently used to manufacture printed circuit boards are formed by laminating multiple double-sided panels, wherein the double-sided panels are formed by alternately laminating an insulating layer and two circuit layers. The method for forming the circuit layer on the upper surface and the lower surface of the insulating layer includes firstly forming a layer of metal copper layer on the upper surface and the lower surface of the insulating layer respectively, and then, using a photolithographic etching process to define the metal copper layer, so as to form a layer on the insulating layer. A circuit layer is formed on the upper surface and the lower surface of the layer respectively. [0003] Figure 1A A schematic top perspective view showing the metal copper layer of an exi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B13/02H05K3/06
Inventor 范智朋
Owner UNIMICRON TECH CORP
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