A multi-parameter automatic control and efficient rotary spray etching system

Abstract

A multi-parameter automatic control and high-efficiency rotary spray etching system, which includes an automatic control center, an etching substrate, a motor, an etching box, an etching solution injection device, a rotating guide rod, a pressure gauge, a flow meter, a centrifugal pump, and an etching solution collection box , ORP (oxidation‑reduction potential) redox meter, heater, delivery pipe, separator, filter, impurity cleaning device, etc. The etching solution flows from the etching collection box into the etching box under the driving of the centrifugal pump, and is sprayed from the nozzle hole of the etching solution spray device to the etching substrate to etch the etching substrate exposed between the photoresists. The invention connects the real-time parameters of the etching liquid spray device, pressure gauge, flow meter, heater and ORP redox meter into an automatic control center, and adjusts the motor power, centrifugal pump power, heater power, etching liquid through real-time feedback concentration and location of the etched substrate. Thus, the entire system is maintained in an optimal stable state that satisfies the given parameters for etching.

Description

technical field [0001] The invention belongs to the technical field of mechanical micromachining, and particularly relates to a spray etching device which can be used for preparing printed circuit board heat exchangers or cylindrical microchannel heat exchangers and even complex surface structures. Background technique [0002] The existing spray etching technology is mainly aimed at flat plate etching. A spray etching system with recyclable etching solution can be designed, and the etching effect under different etching conditions can be studied by adjusting various etching parameters. [0003] The existing invention patent CN108034946A adopts that the etching substrate is fixed in the center of the rotating shaft in a regular hexagonal shape, and the nozzle hole is moved in translation around the surrounding for spray etching. However, due to its non-stop movement, the supply and flow distribution of the etching liquid will appear uneven. The situation is extremely unfavor...

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Problems solved by technology

[0003] The existing invention patent CN108034946A adopts that the etching substrate is fixed in the center of the rotating shaft in a regular hexagonal shape, and the nozzle hole is moved in translation around the surrounding for spray etching. However, due to its non-stop movement, the supply and flow distribution of the etching liquid will appear uneven. The situation is extremely unfavorable to the etching effect; the sprayed etching solution will collide with the etching solution falling from the etching substrate after etching, which will cause the concentration and pressure of the etching solution to decrease and pools will appear on the etching substrate below effect; while the entire system is manually regulated and cannot be simultaneously and associated with the control and monitoring of multiple parameters; and the existing etching system is only for flat plate etching, etching plates of other shapes such as cylindrical, concave Can not be retrofitted and well applied

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