Check patentability & draft patents in minutes with Patsnap Eureka AI!

Electronic device with radiating opening

A technology of electronic devices and sliding components, which is applied in the cooling of circuits, electrical components, and instruments, and can solve problems such as dust intrusion, affecting heat dissipation, and destroying internal electronic components

Active Publication Date: 2008-11-26
ASUSTEK COMPUTER INC
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the heat dissipation openings of electronic devices today are generally openings on the casing, and the openings are open for a long time, which often causes dust to intrude and damage the internal electronic components. The traditional solution is to install a dust cover on the heat dissipation opening, but this Will affect heat dissipation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device with radiating opening
  • Electronic device with radiating opening
  • Electronic device with radiating opening

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention is for reaching above-mentioned purpose, and the technical means adopted and its effect, will exemplify preferred embodiment and coordinate illustration as follows:

[0015] FIG. 1 is an inside view of a case of an electronic device according to a preferred embodiment of the present invention. The casing 105 of the electronic device has a first heat dissipation opening 140 and a sliding portion 136 , and since the first heat dissipation opening 140 is in a closed state, it is indicated by a dotted line. The sliding member 130 is installed on the sliding portion 136 and can slide left and right. The electromagnetic coil 120 is arranged on the left side of the first side 110 of the sliding member 130, and the second side 111 of the sliding member 130 is provided with a fixing part 142 for connecting the first end 146 of the spring 145, and the second end 146 of the spring 145 The end 147 is connected with the pin 150 fixed on the housing 105 of the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electronic device with heat radiation opening is prepared as setting the first heat radiation opening and sliding unit on shell, setting sliding unit at one side of the first heat radiation opening and enabling slide component to slide on said sliding unit, arranging electromagnetic coil and spring separately at two sides of sliding direction for said sliding component opening the first heat radiation opening by sliding said sliding component to the first position under action of said coil when heat radiation condition of said electronic device is met and covering the first heat radiation opening by using said spring to pull said sliding component to the second position when action of said coil is disappeared.

Description

technical field [0001] The invention relates to an electronic device with a heat dissipation opening, in particular to an electronic device that can automatically open / close the heat dissipation opening according to a set condition. Background technique [0002] With the rapid development of information technology and the popularization of computer industry applications, portable devices such as notebook computers have tended to be compact in pursuit of portability and practicality to meet the lifestyle of modern society. [0003] With the improvement of the performance of electronic products and the shrinking of product size, the problems of rising chip temperature and poor heat dissipation have also arisen, which are even serious enough to cause the entire computer system to crash. Therefore, the design of heat dissipation devices has become an important issue. [0004] However, the heat dissipation openings of electronic devices today are generally openings on the casing,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K7/18G06F1/20H01L23/36G12B15/06
Inventor 康伦维
Owner ASUSTEK COMPUTER INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com