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Electronic apparatus and fan thereof

A technology of electronic devices and fans, applied in pump devices, components of pumping devices for elastic fluids, cooling/ventilation/heating transformation, etc., can solve problems such as inapplicability, increased noise, and increased costs

Inactive Publication Date: 2008-12-24
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, as far as the application of the fan in the system is concerned, sometimes the fan cannot be aligned with the heat source due to the placement of other parts in the system, or there are multiple scattered heat sources in the system at the same time, or the fan cannot be aligned. Aiming the fan at the main heat source 1a has to sacrifice heat dissipation to the other heat source 1b
In this case, system manufacturers often use larger-sized or higher-speed fans to dissipate heat, but this will not only increase the cost, but it is undoubtedly the opposite in today's market that emphasizes low profit and miniaturization. What's more, high-speed or large-size fans will cause increased noise.
[0006] In order to solve the above problems, in U.S. Patent No. 6,386,843, it proposes a fan that can take into account the heat dissipation of multiple heat sources; refer to figure 2 In addition, the fan 20 not only forms an inclined surface 21 on the fan frame, but also forms an outward expansion part 22 on one side, thereby increasing the opening and making the heat dissipation effect better; however, the disadvantage is that the fan frame is still Square shape is used as the basis of the design, so it is not suitable when the configuration space in the system is limited

Method used

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  • Electronic apparatus and fan thereof
  • Electronic apparatus and fan thereof
  • Electronic apparatus and fan thereof

Examples

Experimental program
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Effect test

no. 1 example

[0064] Figure 3A is a flow field schematic diagram of the electronic device according to the first embodiment of the present invention, Figure 3B ~ 3C is a schematic diagram of the fan in the first embodiment, wherein, and Figure 3C for along Figure 3B The cross-sectional view of b-b in the middle, and in order to simplify the illustration, Figure 3B ~ 3C The stator and fan blades are omitted, and only the fan frame is used.

[0065] Such as Figure 3A As shown, the electronic device 2 includes a housing 2a and a plurality of heat sources 2b, 2c, wherein the heat sources 2b, 2c and the fan 30 are all arranged in the housing 2a, because of the arrangement of the components, the heat sources 2b, 2c are dispersed from each other, and the electronic The device 2 only has an accommodating space 2d at the edge of the casing 2a where a cooling fan can be disposed. In order to meet the heat dissipation requirements in a limited space, the fan 30 of the present invention chan...

no. 2 example

[0070] Figure 4A is a flow field schematic diagram of the electronic device according to the second embodiment of the present invention, Figure 4B for Figure 4A The top view of the middle fan frame, Figure 4C for along Figure 4B The cross-sectional view of c-c in the middle, and in order to simplify the illustration, Figure 4B ~ 4C The stator and fan blades are omitted, and only the fan frame is used.

[0071] Such as Figure 4A As shown, the electronic device 3 includes a casing 3a, a main heat source 3c, a secondary heat source 3d and a fan 40, wherein the heat sources 3b, 3c and the fan 40 are all arranged in the casing 3a, and the position of the fan 40 is facing the main Heat source 3b, compare Figure 3A and Figure 4A It can be seen that since the distance D between the heat sources 3b and 3c is larger (D>p), the fan 40 has a flared portion with a larger flare angle, so that the range w of the flow field generated by it is larger, and it can be applied to e...

no. 3 example

[0075] Figure 5 It is a top view of the fan according to the third embodiment of the present invention. In this embodiment, the fan 50 has a fan frame 51 and fan blades 52 , and the fan frame 51 has a flared portion 51a inside.

[0076] The difference between this embodiment and the above-mentioned embodiments is that the shape of the fan frame is trapezoidal, and the expansion part is formed along the periphery of the air outlet and the air inlet, so that the shape of the air outlet and the air inlet is roughly fan-shaped, so that it can be used in both systems. In the case of the relative position of the internal heat source and the accommodating space, the dispersed heat sources in the system are dissipated.

[0077] Figure 6 As a modification of the third embodiment, the fan frame shown has flared portions 61 a on both sides, whereby the flow field range of the fan frame can be changed to be applicable to systems with different heat sources.

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Abstract

A fan suitable for electronic devices. The electronic device has an accommodation space and a plurality of heat sources. It is characterized in that: the fan is arranged in the accommodation space, and the fan has a fan frame. The shape of the fan frame is based on the shape of the accommodation space. The fan's flow channel forms an external expansion part according to the spatial position of the accommodation space and the heat source, so as to optimize the heat dissipation of the electronic device.

Description

technical field [0001] The invention relates to a fan and an electronic device with the fan, in particular to a fan which can change the shape of the flow path according to the position of the heat source in the electronic device. Background technique [0002] When improving the air volume characteristics of the general axial flow fan, in addition to improving the fan blades, most of the improvement in the fan frame is to increase the area of ​​the air outlet and air inlet to increase the air inlet and outlet. [0003] Since most of the current fans adopt a square fan frame design, such as Figure 1A As shown, when expanding the conical inclined surface 11 of the air inlet and outlet surfaces of the fan, the range of improvement is limited due to the influence of the fan frame 10, and an optimal design for the flow field cannot be made. [0004] In addition, when a fan is installed in a general system, the center of the fan is usually facing the heat source, so that the fan ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F04D29/54F04D25/08H05K7/20
Inventor 高毓键周宜芳林祖亮黄文喜
Owner DELTA ELECTRONICS INC
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