Flip chip packaging unit and related packaging method

Abstract

The invention provides a flip chip packaging unit and a packaging method for manufacturing the flip chip packaging unit. The flip chip package unit may include an integrated circuit wafer having a wafer first surface on which a plurality of metal posts are fabricated and a wafer second surface opposite to the wafer first surface; a winding substrate which is provided with a substrate first surface and a substrate second surface opposite to the substrate first surface, wherein the wafer first surface of the integrated circuit wafer faces the substrate second surface and is welded on the winding substrate; an underfill material for filling a gap between the wafer first surface of the integrated circuit wafer and the substrate second surface; and a back surface protection film which is directly adhered to the second surface of the integrated circuit wafer, comprises one or more layers of adhesive films, can be well adhered to the back surface of the wafer, is not liable to deform and fall off after being subjected to UV illumination curing, and simultaneously meets the requirements of wafer back surface protection and wafer heat dissipation.

Description

technical field [0001] Embodiments of the present disclosure relate to integrated circuits, and in particular, to packaging structures and packaging methods for flip chips. Background technique [0002] Flip-chip packaging of chips with integrated circuits is a type of integrated circuit packaging. For integrated circuit chips that need to handle higher power, heat dissipation performance is a design index that needs to be considered. At present, when the integrated circuit chip is flip-chip packaged, it is used to wrap the chip with plastic packaging material and then remove the plastic packaging material on the back of the chip to expose the back of the chip to improve the heat dissipation effect. However, the back of the chip is exposed during storage or transportation. Increased risk of damage. Contents of the invention [0003] One aspect of the present disclosure provides an integrated circuit chip (IC) packaging structure, which may include: an integrated circuit ...

AI Technical Summary

Problems solved by technology

At present, when the integrated circuit chip is flip-chip packaged, the chip is wrapped with a plastic packaging material and then the plastic packaging material on the back of the chip is removed to expose the back of the chip to improve the heat dissipation effect. However, the back of the chip is exposed during storage or transportation. increased risk of damage

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