Electronic device test system

Abstract

The electronic component testing device of the present invention pushes the input and output terminals of the IC under test to the socket (50) of the test head for testing; it includes at least a pushing base (34), a guiding pushing base (34), The pushing assembly (30) includes a pushing block (31), a supporting base (32), and two springs (36, 38); the pushing base (34) can be disposed to move closer to and away from the socket (50); The guide pushing base (34) is fixed on the pushing base (34); the pushing block (31) contacts the IC under test from the opposite surface of the socket (50) to push; the supporting base (32) is installed Pushing block (31); the two springs (36, 38) apply elastic force relative to the pushing block (31) through the support seat (32) in the pushing direction of the IC under test; the support of the pushing assembly (30) The seat (32) and the springs (36, 38) are sandwiched between the guide pushing base (34) and the pushing base (35), and the pushing block (31) passes through the opening provided in the pushing base (34). Detachably installed on the support base (32).

Description

technical field [0001] The present invention relates to an electronic component testing device for testing various electronic components (hereinafter also referred to as IC) such as semiconductor integrated circuit elements, and particularly relates to an electronic component capable of applying an appropriate pressing force to an arbitrary electronic component during testing test device. Background technique [0002] In the IC testing device (electronic component testing device) called a handler, a plurality of ICs to be tested are transported to the handling device, and each IC to be tested is brought into electrical contact with a test head to make the The main body of the electronic component testing device (hereinafter also referred to as the tester) is used for testing. When the test is completed, each IC to be tested is removed from the test head, loaded on a tray corresponding to the test result, and classified into acceptable and defective. [0003] In the convent...

AI Technical Summary

Problems solved by technology

[0004] However, in the test process of the conventional electronic component testing equipment, the IC to be tested is pushed down to the contact pin by the pressing mechanism called the pushing unit, but for each product, the IC drawn from the package of the IC to be tested The number of input and output terminals is different from 40 to 130, for example. In addition, the length of the terminals and the shape of the package are also different, so the appropriate pressing force required by the type of IC to be tested is different.

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