Signal transmission assembly and display using same

Abstract

The present invention relates to a signal transmission component. It includes first substrate with first electrode, second substrate with second electrode and a conducting layer. The second electrode at least has a trench; the conducting layer is positioned between first electrode and second electrode, said conducting layer includes colloid and several conductive particles dispersed in colloid. The second electrode is electrically connected with first electrode by means of conducting layer, and the partial colloid is filled in the trench of second electrode. When said signal transmission component is used in a display device, the first electrode of first substrate can make non-display area of display panel be electrically connected with display area, when the second electrode and third electrode of two ends of second substrate are respectively combined with first electrode of first substrate and another third substrate (for example printed circuit broad), the signal can be passed through second substrate, second electrode and first electrode from third substrate and transferred to display area so as to control picture display.

Description

technical field [0001] The present invention relates to a signal transmission component and a display device using the same, in particular to a signal transmission component that can improve the uniformity of glue overflow and increase the strength of bonding and a display device using the same. Background technique [0002] In the module process of liquid crystal display, the display panel and the printed circuit board (print circuit board, PCB) are connected via a flexible printed circuit board (flexible print circuit, FPC) or by a tape carrier package / tape automated bonding, TCP / TAB) to connect to achieve the purpose of transmitting signals. In order to make the display thinner, the latest chip on film package (COF) can make the outer edge of the panel required for bonding smaller, so as to be applied to the thin and light display required by the notebook computer. Although the packaging methods are different, most of the lead electrodes of these "film materials" are ele...

AI Technical Summary

Problems solved by technology

As shown in Figure 4, due to the large area of ​​the pins and pads, after heating and pressing, the poor glue 411 overflows the glue, so that the second substrate 21 and the first substrate 11 can only rely on the proximity of the pins (second Electrode 22) and the conductive particles 413' on the outside of the pad (first electrode 13) achieve the purpose of electrical connection, which is likely to cause poor electrical contact

Furthermore, the excessive colloid 411 accumulated between the lead and the pad due to reaction solidification will also cause insufficient joint strength between the lead (second electrode 22) and the solder pad (first electrode 13), and repeated pulling during the assembly process Or bending may cause the peeling of the lead (second electrode 22) and the pad (first electrode 13)

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