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Heat radiating apparatus

A technology for heat sinks and radiators, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating retrofits, etc., can solve problems such as hindering the thinning of electronic equipment

Inactive Publication Date: 2009-03-04
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, since a large amount of space is required to install such a prior art heat sink, the prior art heat sink becomes a factor preventing electronic equipment from being thinned.

Method used

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  • Heat radiating apparatus
  • Heat radiating apparatus
  • Heat radiating apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] A heat sink according to an embodiment of the present invention will now be described in detail with reference to the accompanying drawings, in which the same reference numerals have been used to designate the same parts.

[0023] figure 2 is a schematic perspective view of a heat dissipation device according to an embodiment of the present invention. image 3 yes figure 2 A schematic exploded perspective view of the heat sink shown. Figure 4 yes figure 2 A schematic cross-sectional view of the heat sink shown.

[0024] Such as figure 2 - As shown in 4, a fixed card 20 may include an upper plate 21 (roughly rectangular in this embodiment) and all fixing legs 22 (set on four corners of the upper plate 21 in this embodiment). At the center of the upper plate 21, a large through hole 21' may be formed. Each fixing leg 22 is fastened directly to, for example, a base plate on which a heat source such as a CPU is mounted. The fixing legs 22 position the upper plat...

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PUM

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Abstract

The present invention provides a heat radiating apparatus which includes a heat sink configured to be positioned in thermal contact with a heat source in order to take heat from the heat source, at least one heat pipe having a portion connected to the heat sink and configured to transfer the heat from the heat sink, a heat exchanger in thermal communication with the at least one heat pipe, formed with a through chamber at a center thereof, and positioned adjacent to the heat sink, and a fan unit installed at least partially in the through chamber of the heat exchanger and configured to generate an airflow through the heat exchanger. Heat generated not only by a specified heat source but also by an interior of electronic equipment can be quickly radiated. In addition, since the heat radiating apparatus may be reduced in size, there is the advantage that it is possible to reduce in size electronic equipment in which the heat radiating apparatus is employed.

Description

technical field [0001] The invention relates to a heat dissipation device. Background technique [0002] As the performance of electronic equipment increases, the amount of heat generated from internal parts also increases considerably. If heat is not stably dissipated, adjacent parts and corresponding heat-generating parts are affected by the heat, so that electronic equipment does not exhibit desired performance or malfunctions due to damage to parts. [0003] In order to solve this problem, a heat sink using a plurality of heat pipes capable of transferring heat over a predetermined distance has been developed. exist figure 1 Such a prior art heat sink is shown in . see figure 1 , a housing 1 is in the shape of a hexahedron, and its two opposite sides are open. A plurality of cooling fins 3 arranged at regular intervals extend from one side of the housing 1 to the opposite side, and each cooling fin 3 has a predetermined thickness and width. The spacing between the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/34G06F1/20G12B15/00
CPCH01L23/467H01L23/427F28D15/0275H01L2924/0002H01L2924/00H05K7/20
Inventor 金敬浩
Owner LG ELECTRONICS INC