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Socket for connecting ball-grid-array integrated circuit device to test circuit

A ball grid array, integrated circuit technology, used in the connection of parts of devices, parts of electrical measuring instruments, connections, etc.

Inactive Publication Date: 2009-04-01
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the open space on the BGA integrated circuit is limited to the rectangular top cover
This in turn limits the size of the heat sink installed on the BGA to dissipate the heat generated when testing the BGA circuit device

Method used

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  • Socket for connecting ball-grid-array integrated circuit device to test circuit
  • Socket for connecting ball-grid-array integrated circuit device to test circuit
  • Socket for connecting ball-grid-array integrated circuit device to test circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] A socket, indicated generally at 10, for connecting a ball grid array (BGA) integrated circuit device and a test circuit is shown in FIG. 1 . The receptacle 10 has at least a positioning plate 12 , a base 14 , a fitting 16 , a stem fitting 18 and a packing guide 20 .

[0022] The positioning plate 12 made of electrically insulating material has a rectangular surface area 22 in which several through-holes 24 for positioning the contacts 30, in particular legs 50 for positioning the contacts 30 (see FIG. 2) The through-holes 24 are defined by rows and columns arranged at regular intervals denoted by the letter X in the first direction and by the letter Y in the second direction perpendicular to the first direction.

[0023] Referring to FIG. 2 , a contact 26 made of a resilient conductive material such as copper or a copper alloy has a generally U-shaped cross-sectional middle portion 28 . The opposite ends of the U-shaped portion 28 extend upwardly to form cantilevers 3...

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PUM

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Abstract

A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.

Description

technical field [0001] The invention relates to a socket for connecting a ball grid array (BGA) integrated circuit device and a test circuit. Background technique [0002] US Patent No. 5,498,970 discloses a socket for temporarily connecting a ball grid array (BGA) integrated circuit device and a test circuit. The socket has a set of contacts corresponding to the ball grid array of the integrated circuit device. Each contact has a set of two cantilevers and terminates at a tip adapted to receive a solder ball of a ball grid array integrated circuit. A sleeve structure is provided for moving each pair of tips between an open position in which the tips are sufficiently spaced from each other to receive an associated solder ball, and a closed position in which the tips are spring-loaded to Clamp the solder ball. The nest structure is formed by a pair of opposing grids, each grid having several parallel cantilevered racks with spaced apart protrusions, and the two opposing gr...

Claims

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Application Information

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IPC IPC(8): G01R1/04H01R13/193H01R33/76H01R12/71
CPCG01R1/0466H01R13/193G01R1/0483
Inventor 内藤匡人南云孝幸
Owner 3M INNOVATIVE PROPERTIES CO