Semiconductor device and lead frame

Abstract

A semiconductor device which can surely prevent a wire bonded to an island from breaking due to, for instance, thermal shock and temperature cycle upon mounting. The semiconductor device includes a semiconductor chip; an island die bonded with the semiconductor chip on the surface; and a wire for electrically connecting the electrode formed on the surface of the semiconductor chip with the island. The semiconductor device is further characterized in that the island has a die bonding region where the semiconductor chip is die bonded, a wire bonding region where the wire is wire bonded, and a continuous groove reaching a circumference of the island are formed between the die bonding region and the wire bonding region of the island.

Description

technical field [0001] This application claims priority based on Japanese Patent Application No. 2005-116051 filed on April 13, 2005. [0002] The present application relates to semiconductor devices and lead frames. Background technique [0003] Conventionally, among semiconductor devices including a semiconductor chip such as an LSI, there is a semiconductor device in which a semiconductor chip is die-bonded to an island, and electrodes formed on the upper surface of the semiconductor chip and the island are connected by wires. use Figure 5 , a description will be given of such a semiconductor device. [0004] Figure 5 (a) is a partial plan perspective view schematically showing an example of a conventional semiconductor device, Figure 5 (b) is a vertical cross-sectional view schematically showing the semiconductor device. [0005] Such as Figure 5 As shown, the semiconductor device 80 includes: a semiconductor chip 81 with a plurality of electrodes 81a formed on the...

AI Technical Summary

Problems solved by technology

Therefore, in the semiconductor devices described in Patent Documents 1 and 2, it is difficult to reliably prevent the disconnection of the first wire 94, and there is still room for improvement.

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