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A manufacturing method of formation of circuit board electricity connection end

A technology of electrical connection pads and board electrical properties, which is applied in the direction of electrical connection of printed components, printed circuit components, and electrical connection of printed components, etc., which can solve the inconvenience of the process, the shape and size of the solder material, and the product quality and reliability. Reducing problems such as reducing production costs, simplifying production processes, ensuring quality and reliability

Active Publication Date: 2009-08-05
PHOENIX PRECISION TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the solder material has viscosity (Viscosity), when the number of printings increases, the solder material remaining in the stencil hole wall is relatively more, resulting in the amount and shape of the solder material used for the next printing not meeting the design specifications. Therefore, usually in actual operation When using a certain number of printings, the template must be wiped and cleaned, otherwise it is very easy to produce problems such as the shape and size of the solder material, which will cause inconvenience in the process and reduce the quality and reliability of the product.

Method used

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  • A manufacturing method of formation of circuit board electricity connection end
  • A manufacturing method of formation of circuit board electricity connection end
  • A manufacturing method of formation of circuit board electricity connection end

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0017] Figure 2A to Figure 2I It is a schematic cross-sectional view of Embodiment 1 of the manufacturing method for forming the electrical connection end of the circuit board in the present invention.

[0018] see Figure 2A Firstly, a circuit board 20 is provided, and a plurality of first electrical connection pads 20 a and second electrical connection pads 20 b have been formed on the surface of the circuit board 20 . The area of ​​the first electrical connection pad 20a is smaller than the area of ​​the second electrical connection pad 20b. It can be understood that this embodiment 1 is only used as an example to describe the present invention. The first electrical connection The number and size of the pads 20a and the second electrical connection pads 20b are not limited thereto, and different numbers and sizes can be selected according to specific situations, and are not limited to any side of the circuit board. In addition, a plurality of conductive lines (not shown)...

Embodiment 2

[0029] Figure 3A to Figure 3I A schematic cross-sectional view of Example 2 of the method for forming the electrical connection end of the circuit board of the present invention will be described in detail.

[0030] see Figure 3A First, a circuit board 30 is provided, one surface of the circuit board 30 is formed with a plurality of first electrical connection pads 30a and second electrical connection pads 30b, and the other surface of the circuit board 30 is formed with a plurality of third electrical connection pads. connection pad 30c. The first, second, and third electrical connection pads 30a, 30b, and 30c of the circuit board 30 can be electrically connected to each other through an interlayer conductive structure such as a conductive via or a blind hole (not shown). It should be noted that this embodiment and its accompanying drawings are only for illustration, and the number and area of ​​the first, second, and third electrical connection pads 30a, 30b, and 30c are...

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Abstract

A method for forming electrical connection ends of a circuit board, which provides a circuit board with a plurality of electrical connection pads formed on the surface, and a plurality of openings are formed on the surface of the circuit board to expose the insulating protective layer of the electrical connection pads. A conductive layer is formed on the surface of the insulating protective layer and the electrical connection pad, and a resistance layer is arranged on the surface of the conductive layer, so that the resistance layer forms an opening corresponding to a part of the electrical connection pad to expose the conductive layer, and then the resistance layer is formed on the surface of the resistance layer. The first metal layer is formed in the opening, and an opening is formed in the resistance layer corresponding to another part of the electrical connection pad that is not provided with the first metal layer, exposing the conductive layer, and then the first metal layer and the other part of the electrical connection pad are exposed. The second metal layer is formed on the electrical connection pad, and different types of electrical connection terminals are formed on the surface of the circuit board; the invention uses a simple and effective method to plate solder of different heights and sizes on the electrical connection pad of the circuit board to form different heights and The size of the electrical connection terminal is electrically connected with different electronic components.

Description

technical field [0001] The invention relates to a method for forming electrical connection ends of circuit boards, in particular to a method for forming different types of electrical connection ends on the surface of circuit boards. Background technique [0002] In the current flip-chip technology, an electrode pad (Electrode Pad) is arranged on the surface of a surface mount (Surface Mount Device; SMD) semiconductor element, such as a semiconductor integrated circuit (Integrated Circuit; IC) chip, and an organic Corresponding electrical connection pads are formed on the circuit packaging substrate. By providing solder bumps or other conductive adhesive materials between the chip and the circuit packaging substrate, the chip is provided with an electrical contact surface facing down. On the circuit packaging substrate, wherein the solder bump or the conductive adhesive material provides electrical input / output (Input / Output; I / O) and mechanical connection between the chip an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40H05K1/11H01R12/00
Inventor 王音统
Owner PHOENIX PRECISION TECH CORP