Electronic beam exposure process sample wafer step-by-step positioning error dynamic compensating system

Abstract

A electron-beam exposal processing sample step-by-step orientation error dynamic compensation system, including: the CPLD (complex programmable logic device) logic circuit module (-), the X direction high-speed photoelectricity isolation module (-), the Y direction high-speed photoelectricity isolation module (-), the X direction 16 bit high-speed high-precision digital-model transforming module (-), the Y direction 16 bit high-speed high-precision digital-model transforming module (-), the X direction output polarity controlling module (-),the Y direction output polarity controlling module (-), the X direction attenuation matching unit (-),the Y direction attenuation matching unit (-). During the electron-beam exposal process, the X direction location error signal of the sample and the Y direction location error signal of the sample connects with the CPLD logic circuit module (-) by the unattached 16 bit data line, processes the computation and transform, finally gets the deflexion pressure signal of the X direction and the Y direction on the outputting port. The signal enters the deflexion loop controlling circuit of the electron-beam exposal unit, controls the scanning location of the electron-beam exposal unit focus electron-beam to achieve the dynamic compensation of the sample step-by-step error.

Description

technical field [0001] The invention relates to a sample step positioning error compensation system in the electron beam exposure process. Background technique [0002] In the field splicing exposure process of the electron beam exposure machine, the accuracy of the stepping distance of the processed sample determines the quality of the field splicing exposure. The above sample stepping distance is obtained by moving the sample stage along the X and Y directions of the exposure field under the drive of the closed-loop measurement control system. However, due to the inertia of the sample stage itself, mechanical friction, and the use of a higher movement speed of the sample stage in order to improve production efficiency, there will be a deviation of several microns between the actual stepping distance of the sample and the ideal moving distance. In order to solve this deviation, two measures are usually taken. The first is to further narrow the target position interval in ...

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Problems solved by technology

However, due to the existence of friction, the above two positioning methods will have a certain positioning error, and neither of them can avoid the positioning error caused by external vibration interference or self-excited vibration.

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