Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip welder, hot-crimping band chip and bonding method and system thereof

A technology of chip welding and welding mechanism, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc. It can solve the problems of low rigidity, inability to transport thermocompression tapes, etc., and achieve the effect of preventing clogging

Active Publication Date: 2009-12-09
SHINKAWA CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a thin thermocompression bonding tape has low rigidity. Therefore, in the tape conveying mechanism described in Patent Documents 1-3, when it is sent to the cutting mechanism, the frictional force on the sub-tape is applied due to the frictional force between the surface of the cutting mechanism and the tape. The compression force is greater than the buckling load of the belt, so the so-called clogging occurs due to buckling of the belt, and there is a problem that the thermocompression bonding belt cannot be transported

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip welder, hot-crimping band chip and bonding method and system thereof
  • Chip welder, hot-crimping band chip and bonding method and system thereof
  • Chip welder, hot-crimping band chip and bonding method and system thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] Such as figure 1 and figure 2 As shown, the die bonding machine 10 is provided with a tape bonding mechanism 100 , a die bonding mechanism 200 , a frame feeder 17 , and a wafer rack 18 . The tape bonding mechanism 100 cuts out a thermocompression bonding tape 23 of a predetermined size from the thermocompression bonding tape 41 for semiconductor chip bonding, and bonds the thermocompression bonding tape 23 to the lead frame 22 or on the semiconductor chip 24 that has been welded; the chip bonding mechanism 200 will thermally compress the semiconductor chip 24 on the lead frame 22 through the bonded thermocompression tape 23; the frame feeder 17 will supply the lead frame 22 with the tape Chip bonding mechanism 100 and chip bonding mechanism 200; the wafer holder 18 holds the diced wafer. In the following description, the conveying direction of the lead frame 22 is defined as the X direction, the direction perpendicular to the X direction in the horizontal plane is de...

Embodiment 2

[0151] Another embodiment of the die bonder according to the present invention will be described with reference to the drawings. The same parts as in Embodiment 1 are assigned the same symbols, and descriptions thereof are omitted. The die bonder 10 of this embodiment cuts out a thermocompression bonding tape 23 smaller in size than that of the first embodiment, and bonds it to the lead frame 22 . Therefore, the lead-out length of the thermocompression bonding tape 41 to the holding substrate 35 is short, and the ventilation holes 43 and grooves 43a for absorbing and fixing the thermocompression bonding tape 41 drawn out to the holding substrate 35 are set to correspond to the short lead length. scope. Therefore, the number of vent holes 43 and grooves 43a is less than that of the first embodiment. Others are the same as in Example 1.

[0152]Next, the cutting and bonding operations of the thermocompression bonding tape piece 23 in the die bonder 10 of this embodiment will ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a die bonder, which performs conveyance of a thermo-compression bonding tape and transfer and attaching of a cut strip of the thermo-compression bonding tape strip with a simple structure and prevents wrinkling of the thermo-compression bonding tape during the conveyance thereof. The die bonder includes a guide 33 that guides a bonding tape 41, a tape suction chuck 13, a retention substrate 35, and a cutter 60. The tape suction chuck 13 sucks the thermo-compression bonding tape 41 on the guide 33 at an initial position, and draws the tape onto the retention substrate in the longitudinal direction of the tape. The drawn tape 41 is sucked and fixed onto the retention substrate 35 and is cut off with the cutter 60 to form a thermo-compression bonding tape strip. The tape suction chuck 13 sucks the thermo-compression bonding tape strip 23, transfers the same onto a lead frame to attach the thermo-compression bonding tape strip to the lead frame. After the tape is attached, the tape suction chuck 13 returns to the initial position.

Description

technical field [0001] The present invention relates to a structure of a die bonder, a method of cutting and bonding a thermocompression bonding tape piece from a thermocompression bonding tape for semiconductor chip bonding in the die bonder, and a system thereof. Background technique [0002] The die bonding process, which is one of the semiconductor device manufacturing processes, refers to fixing a semiconductor chip formed in a previous process to a lead frame or a chip of a lead frame. In the fixation to the semiconductor chip in the die bonding process, the following thermocompression bonding method is used: Form the bonding resin on the double-sided adhesive thermocompression bonding tape, cut it into a thermocompression bonding tape piece of a certain size, and supply The chip is thermocompression-bonded by the thermocompression bonding tape, and the semiconductor chip and the chip are thermocompression-bonded (for example, refer to Patent Document 1). [0003] Gen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50
CPCH01L24/743H01L2224/743H01L2924/00H01L21/02H01L21/30H01L21/78
Inventor 藤野昇佐藤安
Owner SHINKAWA CO LTD