Semiconductor chip automatic centering mechanism

Abstract

The invention relates to technology for centering and lifting a wafer during processing a semiconductor wafer, namely a mechanism for centering and lifting a machine, in particular to an automatic centering mechanism of a semiconductor wafer, which can solve the problems such as difficult control on centering accuracy of the wafer, and adopt an automatic centering mode of meeting requirement of centering accuracy for processing the semiconductor wafer. The centering mechanism is provided with a splicing plate, a centering block, a connection plate, a bearing pedestal and a cylinder, wherein the splicing plate and the centering block are fixed on the bearing pedestal respectively, and the bearing pedestal is connected with the cylinder through the connection plate. Two centering mechanismsform a group, and the centering mechanisms at two sides work synchronously during centering. The centering process is divided into two steps, namely splicing and centering. The centering mechanism canexchange sizes of the centering block and the splicing plate according to the size of the processed wafer.

Description

technical field [0001] The invention relates to the technology of centering the wafer and realizing the raising and lowering of the wafer during the processing of the semiconductor wafer, that is, a mechanical centering and lifting mechanism, in particular an automatic centering mechanism of the semiconductor wafer. Background technique [0002] In the process of semiconductor wafer processing, the position of the wafer needs to be accurately positioned so as to ensure the processing accuracy, so many devices and modules are equipped with centering units. In some facilities, alignment of wafers is done manually, which is inefficient and not conducive to high-volume production. [0003] In the current automatic centering method, the centering module is separated from the wafer processing module. Wafers pass through a separate centering module before being fed into the processing module. In this way, there is still a transfer process after the wafer is centered, and it is ve...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above-mentioned shortcomings, the object of the present invention is to provide an automatic centering mechanism for semiconductor wafers, which can solve the problems of difficulty in controlling the centering accuracy of the wafer, and it is an automatic centering method that meets the centering accuracy requirements of semiconductor wafer processing

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