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Use of microcrystalline polyamide for obtaining a specific surface state

A polyamide, copolyamide technology, used in textile decoration, textiles and papermaking, etc., can solve the problems of unsuitable re-replication of mold surface finishing and touch, low transparency, etc.

Active Publication Date: 2007-07-25
ARKEMA FRANCE SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these semi-crystalline polyamides have the disadvantage of having limited transparency and rapidly going into the solid state when they cool (due to their rapid and high recrystallization rate), and are therefore not suitable for faithfully reproducing mold surface finishes and sense of touch
[0010] - low transparency;

Method used

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  • Use of microcrystalline polyamide for obtaining a specific surface state
  • Use of microcrystalline polyamide for obtaining a specific surface state

Examples

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Embodiment Construction

[0049] As examples of microcrystalline polyamides, mention may be made of transparent compositions comprising in total 100% by weight:

[0050] - 5-40% of amorphous polyamide (B) obtained essentially by condensation of:

[0051] At least one diamine selected from cycloaliphatic diamines and aliphatic diamines and at least one diacid selected from cycloaliphatic diacids and aliphatic diacids, at least one of these diamine or diacid units being cycloaliphatic,

[0052] or cycloaliphatic α,Ω-aminocarboxylic acids,

[0053] or a combination of these two possibilities, and

[0054] optionally at least one monomer selected from the group consisting of α,Ω-aminocarboxylic acids or possibly corresponding lactams, aliphatic diacids and aliphatic diamines;

[0055] 0-40% of flexible polyamides (C) selected from copolymers and copolyamides containing polyamide blocks and polyether blocks;

[0056] 0-20% of compatibilizer (D) for (A) and (B);

[0057] ●0-40% flexible modifier...

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Abstract

The invention relates to the use of a microcrystalline polyamide for producing an object whose entire or partial external surface consists of said microcystalline polyamide having a specific surface state and wherein the object production involves heating stages between a Tg (vitreous transition temperature) and a Tm (fusion temperature) of said microcrystalline polyamide, the microcrystalline polyamide transparency is such that the light transmission of 560 nm to a polished 1 mm thick object is >80 %, preferably >88 %, wherein said transparency is measured on the obtained object by means of usual methods for carrying out calandring film injection or extrusion. Advantageously, said microcrystalline polyamide has a crystallinity ratio ranges from > 10 % to > 30 % (1st DSC heating according to ISO 11357 at 40 DEG C / m) and a fusion enthalpy from > 25J / g tot < 75J / G (1st DSC heating according to ISO 11357 at 40 DEG C / m). In the preferred embodiment, the Tg (vitreous transition temperature) ranges from 40 DEG C to 90 DEG C and the Tm (fusion temperature) ranges from 150 DEG C to 200 DEG C. Advantageously, a monomer linking is carried out in such a way that 50 and more % by weight of said monomers are in >=C9 (number of carbon atoms >=9).

Description

technical field [0001] The present invention relates to the use of microcrystalline polyamides for obtaining specific surface finishes. More precisely, this is a specific type, being solid but malleable, specifically capable of replicating surface finishes (small scale reliefs) and moldings (large scale reliefs, deep reliefs) and converting itself Or the application of transparent materials that can be bonded to the substrate by means of curved pathways, all with the aim of producing objects with aesthetic, attractive and high-quality visual and tactile properties and resistant to mechanical, chemical and physical attack . [0002] This may involve compression-molded or injection-moulded bulk objects made of the microcrystalline polyamide, or complete or partial covering of the outer layer of the object. The outer layer may also be the outer layer of a multilayer structure covering the substrate. When its thickness is at most about 0.5-1 mm, the structure is also referred t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08L77/12C08J5/00C08L77/00D06Q1/08
CPCC08L77/12C08L77/06C08L77/00C08L2666/20
Inventor 蒂博·蒙塔纳利克里斯特尔·雷科奎尔
Owner ARKEMA FRANCE SA