Method and apparatus for performing heat radiation of electric component on circuit board

Abstract

The invention discloses one method for heat dissipation in circuit board electron part, which comprises the following steps: dividing the circuit board electron part into multiple sets; through circuit board to form wind guide channel to let gas flow into remote each electron part; through forming wind exit guide channel to guide each electron part gas flow into circuit board outside to make one set of electron gas flow not through other set electron parts. The invention avoids gas flow heat overlap to improve dissipation effect.

Description

technical field [0001] The invention relates to the communication field, in particular to a method and device for dissipating heat from electronic components on a circuit board. Background technique [0002] At present, a subrack is the basic form of a complete communication device. Referring to FIG. 1 , a plurality of printed circuit boards (PCB boards 2 ) are inserted side by side in a subrack 1 . The PCB board 2 is plugged into the subrack 1 and electrically communicated with the mother board to obtain power and realize communication with other PCB boards 2 in the subrack 1 at the same time. There are various electronic heating devices on the PCB board 2 , so the airflow generally needs to flow through the PCB board 2 from bottom to top to dissipate heat for each PCB board 2 . [0003] The following uses a 10Gb small pluggable optical transceiver module (XFP optical module) on the PCB 2 as an example for illustration. As shown in FIG. 2, the XFP optical module is an imp...

AI Technical Summary

Problems solved by technology

This arrangement leads to a great deterioration of the heat dissipation capability of the XFP optical module 3 from the following two aspects:

[0005] 1. Since the XFP optical modules 3 all have radiators, the air resistance of the optical module array is much larger than that of the adjacent area, and a large amount of airflow will be bypassed from the low air resistance area next to it, resulting in serious air volume passing through the optical module group. insufficient

[0006] 2. Along the direction of the airflow, the heat emitted by the optical module upstream of the airflow will be carried downstream, so that the temperature of the optical module at the downstream position of the airflow will rise. The closer to the air outlet side, the higher the temperature of the optical module is, It is easy to exceed the maximum allowable temperature (about 70 degrees Celsius), which will affect the transmission performance of the XFP optical module 3, or even fail to work normally

In the case of a large number of optical modules, this solution still cannot overcome the heat superposition of the XFP optical module 3 in the airflow direction, resulting in a gradual increase in temperature

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