Electronic substrate, semiconductor device, and electronic device
A technology for electronic substrates and substrates, used in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as the decline in transmission efficiency, achieve easy installation, prevent reliability decline, and improve transmission efficiency. Effect
Inactive Publication Date: 2007-09-05
SEIKO EPSON CORP
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Problems solved by technology
However, when three or more electronic substrates are stacked, electromagnetic waves must be transmitted and received through the medium of the electromagnetic shielding substrate, and there is a problem that the transmission efficiency decreases.
Method used
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no. 1 Embodiment approach
no. 2 Embodiment approach
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An electronic substrate includes: a base substrate having an active face and a rear face; inductor elements formed on or above the active face, and formed on or above the rear face; and a conductive member electrically connected to the inductor element formed on or above the rear face, penetrating through the base substrate from the active face to the rear face.
Description
technical field The present invention relates to an electronic substrate, a semiconductor device and an electronic machine. Background technique Electronic devices (semiconductor chips) including integrated circuits are mounted on electronic devices such as mobile phones, notebook computers, and PDAs (Personal data assistance). Usually, connection terminals are formed on the electronic substrate, and the electronic substrate is mounted on another electronic substrate or mother substrate (motherboard) through the connection terminal. Thus, transmission and reception of signals such as power transmission and communication can be performed between this electronic substrate and other electronic substrates, main boards, and the like. However, when connecting terminals are formed on an electronic substrate, there are problems in that the structure is complicated and the work of mounting the connecting terminals on other electronic substrates, mother substrates, etc. is troubl...
Claims
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IPC IPC(8): H01L27/02H01L23/485H01L23/522H01L25/00
CPCH01F17/0006H01L2924/0002H01F38/14H01F5/003H01L2224/16H01F17/0013H01Q1/38H01Q1/2283H01Q1/2266H01F27/292H01L23/12
Inventor 桥元伸晃
Owner SEIKO EPSON CORP