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Switchable on-die decoupling cell

A switch control and chip technology, applied in the direction of electrical components, output power conversion devices, semiconductor/solid-state device components, etc., can solve the problem of not providing series resistance

Inactive Publication Date: 2007-10-03
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current packaged capacitor technology may not provide effective series resistance to suppress oscillations caused by packaged chip resonances, which can occur in the 100MHz-1GHz range

Method used

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  • Switchable on-die decoupling cell
  • Switchable on-die decoupling cell
  • Switchable on-die decoupling cell

Examples

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Embodiment Construction

[0015] Figure 2 shows an example of a simplified equivalent circuit diagram of a power supply supplied to an integrated circuit (IC). This power is provided to the IC (power supply node 200 ) through a voltage regulator 210 . An IC-based transiently active IC chip consumes a variable amount of current 220 . Fast current transients can occur due to variable IC current draw and cause the supply voltage to oscillate. Oscillations in power supply levels can lead to significant degradation of IC performance, higher reliability hazards, and even system failure. Power delivery decoupling can be used to reduce the magnitude of voltage oscillations. The voltage regulator 210 and its effective output impedance 230 may cease to stabilize the voltage level for current load transients whose spectral content is greater than a certain level (eg, 100 KHz). Mainboard and package decoupling components 240 can help reduce supply voltage oscillations for a limited frequency range (eg, up to 10...

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PUM

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Abstract

In general, in one aspect, the disclosure describes a switchable on-die decoupling cell. The switchable on-die decoupling cell includes a decoupling device and a device damping element. The device damping element can serve as a digital. The damping element may be switched off in a low power mode to preserve power. Other embodiments are disclosed herein.

Description

technical field [0001] The present invention relates to a switchable on-die decoupling unit and integrated circuits and systems comprising the decoupling unit. Background technique [0002] Integrated circuits (ICs) are typically powered by one or more supply voltages provided by external high-efficiency voltage regulator modules near the IC package. This power is provided to the integrated circuit chip through power planes, pins, vias and bumps. Voltage drops can occur when rapid current transients occur due to variable chip activity. Use power delivery decoupling components to reduce these voltage drops. Decoupling components may include motherboard, package discrete capacitors, and on-chip decoupling units (as capacitors). [0003] The effective series inductance of the package capacitor together with package parasitic inductance makes the package capacitor ineffective as a decoupling element at frequencies above 100MHz. Because modern ICs cause significant current tr...

Claims

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Application Information

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IPC IPC(8): H02M1/00H01L23/64H01L23/66
CPCH01L2924/0002H01L27/0805H01L23/5223H01L27/0629H01L2924/3011Y10T307/74H01L2924/00
Inventor O·维金斯基N·夏米尔
Owner INTEL CORP