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Method for equipping a component support

A technology of parts and carriers, applied in the field of parts carrier assembly parts, can solve problems such as unqualified connection quality, and achieve the effect of improving accuracy and speed

Active Publication Date: 2011-07-06
西门子电子装配系统两合公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Deformation of the solder paste, for example, can lead to undesired short circuits between different connection surfaces and can lead to substandard connections between the connected part of the component and the component carrier

Method used

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  • Method for equipping a component support
  • Method for equipping a component support
  • Method for equipping a component support

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] As shown in Figures 1a and 1b, the placement process known from the prior art for placing a component 160 onto a printed circuit board 170 is to use a suction tube 110 that picks up the component 160 with an arrow Expressed speed v z Move in the direction of the printed circuit board 170 . When the component 160 is placed in a prescribed component mounting position, the connection contacts 161a and 161b of the component 160 are pressed into the deposits 172a and 172b. The deposits 172a, 172b installed on the connection surfaces 171a and 171b of the printed circuit board 170, for example, contain solder paste, so that after the assembly of the component 160 is completed, a soldering process can ensure that there is a good connection between the connection contact 161a and the connection surface 171a. Permanent electrical contact is established between the connection contacts 161b and the connection surface 171b.

[0029] As shown in Figure 1b, the depth to which the pa...

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PUM

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Abstract

The invention relates to a method for equipping a component support (270) with components (260). According to said method, a component (260) is picked up by a holding device (210) of a fitting head by means of a retaining force that is applied to the component (260) by said holding device (210). The picked up component (260) is conveyed by the fitting head to a predefined discharging position above a component assembly point located on the component support (270). The retaining force is switched off when the discharging position has been reached such that the component (260) detaches from theholding device (210) and is transferred to the component support (270). In order to increase the process safety of the component transfer, the component (260) is detached when the holding device (21)is stopped as abruptly as possible such that the transfer of the component is aided by the mechanical inertia of the component (210). The detaching process of the component (260) from a suction pipette (210) that is used as a holding device can be additionally supported by a pneumatic on-off valve that switches a negative pressure with which the component (260) is retained on the suction pipette (210) into an excess pressure, the suction pipette (210) assisting in discharging the component (260) with the aid of blow air.

Description

technical field [0001] The invention relates to a method for assembling components for a component carrier, in which the components to be assembled are transported from a component supply to an assembly area by means of an assembly head and placed on the component carrier in a defined manner on the installation position of the components. Background technique [0002] The so-called surface mount technology ( S surface M ount T When assembling parts carriers within the category of echnology, SMT), SMT parts are picked up from a pick-up position of a parts supply device by means of an assembly head, and placed on the specified part installation position on the parts carrier superior. In the following, the concept of "component carrier" refers to any kind of substrate that can be assembled, especially printed circuit boards. "Component" refers to all assembleable components, especially bipolar or multipolar SMT components or other types of highly integrated planar componen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0408H05K13/0409H05K13/0413
Inventor 冈特·希贝尔
Owner 西门子电子装配系统两合公司