Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system

A semiconductor and identification code technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as insufficient management system, and achieve the effect of simplifying the manufacturing process

Inactive Publication Date: 2008-01-23
TOKYO ELECTRON LTD +1
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the use of identification code information becomes possible only after the IC chip is packaged, and there arises a problem that this method is insufficient as a management system for manufacturing control

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system
  • Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system
  • Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1A to 1C are schematic diagrams of semiconductor chips with identification codes of the present invention, in which the identification code 3 is formed at a predetermined position near the outer edge of each chip 2 divided from the wafer 1. The identification code 3 is characterized by a combined form of an electrical storage code and an optically readable code. In other words, as shown in FIG. 1C, the electrical identification code is formed by a combination of a plurality of storage elements 4 (shown by the dotted line in the figure), and as the storage element 4, for example, the one shown in FIGS. 2A to 2C is used inverter. The wiring pattern 5 of the storage element 4 is configured to be optically readable from the outside, and is used as an optical identification code. The optical identification code reads the wiring pattern 5 as binary ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

There is provided a semiconductor chip using an electrical identification code and an optical identification code, both of the codes being formed in the same process to be always in one-to-one correspondence with each other. An optically readable wiring pattern associated with an electrically readable identification code is formed on a top layer of the semiconductor chip or a layer that is optically identifiable from the top layer, and used as an optical identification code. The semiconductor chip is thus provided such that the optically readable wiring pattern is part of wiring of memory elements that electrically store an identification code, and comprised of a combination of wiring forms set as 1 or 0 that is an output of each of the memory elements.

Description

Technical field [0001] The present invention relates to an apparatus for identifying a semiconductor chip through an identification code, and more specifically, to a semiconductor chip that uses both optically readable identification code and electronically readable identification code to identify, a method of manufacturing such a chip, and a device that uses these identification codes. Semiconductor chip management system. Background technique [0002] At the chip or wafer stage, or when forming an integrated circuit, the semiconductor device is tested in order to check whether there is a defect, and the information of the test result is marked on each chip as an identification code. As a code for testing information, since the amount of information is relatively small, optically readable identification codes such as barcodes and markings are often used. [0003] At the same time, in order to process control, subsequent quality investigations, etc., as well as the above-mentione...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544
CPCH01L2223/5448H01L2223/5444H01L2223/54433H01L23/544H01L2924/0002H01L2924/00H01L21/02
Inventor 林博昭稻浪良市岸本克己
Owner TOKYO ELECTRON LTD