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Clamping device and method for mature making process

A clamping device and curing technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as deformation of blue steel sheets, and achieve the effect of improving warpage

Inactive Publication Date: 2010-07-28
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the blue steel sheet is too soft, the blue steel sheet is easily deformed by warping with a certain semiconductor package configuration

Method used

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  • Clamping device and method for mature making process
  • Clamping device and method for mature making process
  • Clamping device and method for mature making process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] refer to Figure 4 and Figure 5 , which shows a clamping device of one embodiment of the present invention. The clamping device 100 can be applied to a curing process of a product 102 (eg, a plurality of semiconductor package structures 116 having a sealing material). The clamping device 100 includes an upper pressing plate 112 , a lower pressing plate 114 , an elastic adjustment unit 150 , a clamp body 118 and a lifting unit 120 . The lower platen 114 is used to carry the product 102 to be heated. The lifting unit 120 is used to lower the fixture body 118 and the upper pressing plate 112 , so that the upper pressing plate 112 and the lower pressing plate 114 press the product 102 from up and down respectively. For example, the lifting unit 120 can use the torque wrench 122 to move the clamp body 118 and the upper pressing plate 112 along the lead screw 124 and at least one guide rod 126 to exert pressure on the product, such as 120 kgf.

[0020] Both ends of the e...

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PUM

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Abstract

A holding device comprises an upper pressure plate, a lower pressure plate, a clamp substance, an up-and-down unit and an elasticity adjusting unit. The lower pressure plate is used to support products. The up-and-down unit is used to make the clamp substance and the upper pressure plate descend, thus the upper pressure plate and the lower pressure plate presses the product from both top and bottom. The two ends of the elasticity adjusting unit are fixed respectively on the upper pressure plate and the clamp substance. The elasticity adjusting unit provides the elasticity that the upper pressure plate presses the products.

Description

【Technical field】 [0001] The present invention relates to a clamping device, in particular to a clamping device with an elastic force adjustment unit, which can provide elastic force to make the upper pressing plate of the clamping device flatly press the product. 【Background technique】 [0002] In the injection molding sealing process of the semiconductor packaging structure, the material used is a polymer molding compound, which is a thermosetting plastic. Based on the demand for product yield and production capacity, the general method is to divide the curing process of the entire polymer sealing material into two stages. The first stage is the glue injection and curing process, and then the product is taken out and placed under heavy weight. Bake in the oven for the second stage of post-curing process. [0003] In detail, the post-curing process is to send the sealed product into an oven for baking. The purpose is to accelerate the curing of the polymer sealing material...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
Inventor 张嘉铭
Owner ADVANCED SEMICON ENG INC