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An open kettle mouth at tin overflow corner

A technology of tin overflow and quarrel, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of low work efficiency, unsuitable for large-scale batch processing, easy to form false soldering of contacts, etc., and achieve the effect of ensuring sufficiency and firmness

Inactive Publication Date: 2008-03-26
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • An open kettle mouth at tin overflow corner

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Effect test

Embodiment Construction

[0012] As shown in Figure 1, a tin overflow spout is opened at the corner, the shape of the spout is rectangular, and at least one corner of the tin outlet of the spout is provided with a tin overflow mouth 1, and the tin overflow mouth 1 is A rectangular opening with a depth of 2 to 8 mm.

[0013] As shown in Figure 2, the spout of the present invention is mainly applied to the welding of "L"-shaped lead wires. The thick solid line in the figure represents the overflow tin opening. The length of the lead group is determined, and at the same time, other electronic components 3 outside the tin overflow port 1 are taken into consideration to ensure that the tin liquid flowing out from the tin overflow port 1 will not affect other electronic components 3 that do not need to be soldered near the periphery of the pot mouth.

[0014] When in use, place the PCBA board at a predetermined position above the spout, and keep a certain distance between the board plane and the tin outlet o...

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Abstract

The invention relates to a tin furnace component used to PCBA board soldering tin, in particular to a tin furnace kettle orifice. The kettle orifice has a rectangular shape, a tin overflow outlet 1 is arranged at least at one corner of the kettle orifice tin outlet, the tin overflow outlet 1 is a rectangular opening, the deepness is 2-8mm. The invention has a simple structure, can improve the soldering efficiency, is suitable for mass automatic production, in addition, effectively prevents an oxide layer of the tin liquid surface from remaining on the PCBA board, assures the welding joint quality.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the same time, it is guara...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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