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Three-dimensional configurations providing electromagnetic interference shielding for electronics enclosures

一种电磁干扰屏蔽、电子设备的技术，应用在磁场/电场屏蔽、屏蔽材料、电气元件等方向，能够解决昂贵、耐受性差等问题，达到充分EMI屏蔽、廉价屏蔽解决方案的效果

Inactive Publication Date: 2008-05-21
TORTURED PATH EMI SOLUTIONS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

They are poorly tolerated and very expensive
Furthermore, existing manufacturing techniques designed to address these issues required forming the housing so that it had to have tongue and groove joints or other prohibitive solutions

Method used

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  • Three-dimensional configurations providing electromagnetic interference shielding for electronics enclosures
  • Three-dimensional configurations providing electromagnetic interference shielding for electronics enclosures
  • Three-dimensional configurations providing electromagnetic interference shielding for electronics enclosures

Examples

Experimental program
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Embodiment Construction

[0088] Utilizing the "shell" or "scallop" embodiment of the invention as shown in Figures 5A and 5B, three-dimensional shapes can be formed or otherwise configured such that they generally extend along the inner perimeter of the edge and the two parts FSE and FL come together in together, and satisfy the "sinusoid". All that is necessary to implement the 3D implementation of the invention is to "cut" or stamp the edges of the metal, and do the same cuts, and they come together in a "30 gap" or something like that. Advantages of the basic embodiment of the invention include, inter alia, the fact that no contacts are required and thus do not deteriorate over time (see FIG. 9B ). It is not necessary for the FSE and FL parts to make physical contact. Further advantages include the absence of tolerances and the absence of deformation.

[0089] Referring again to FIG. 5A , a first embodiment of a three-dimensional EMI shielding solution for electronic device enclosures is shown in...

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Abstract

The present invention provides a configuration of an electronics enclosure, including a computer chassis in which three-dimensional shapes that may be in the form of a partial or quarter-sphere or cube or other periodic ''patterns'' may be stamped, molded, cut, or extruded into a lid and a five-sided ''box'' to provide improved EMI shielding, such that the need for gaskets is reduced or eliminated.

Description

[0001] Priority Document Reference [0002] This application claims U.S. Patent Application Serial No. 11 / 270,827, entitled THREE-DIMENSIONAL CONFIGURATIONS PROVIDING ELECTROMAGNETIC INTERFERENCE SHIELDING FORELECTRONICS ENCLOSURES, filed November 10, 2005 Priority of the application which is a continuation-in-part and claims the invention of Paul Douglas Cochrane, filed March 15, 2005, entitled "Cost Reduction and Pad and Other Fabrication Uses" Priority under 35 USC § 120 of US Application Serial No. 11 / 080,385 for "Reduced cost and gasketting "one-hit" and other manufacturing EMI-shielding solutions for computer enclosures". This application also claims Paul Douglas Cochraney's filed January 10, 2005 titled "Gasketless "one-hit" Electromagnetic Shielding Solutions for Making Computer Cases and Other Electronic Component Housings." Priority to 35 USC § 119(e) of US Provisional Application Serial No. 60 / 642,694 for electromagnetic interference (EMC) shielding solutions for the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
CPCH05K9/0073H05K9/0009
Inventor 保罗·道格拉斯·科克拉内
Owner TORTURED PATH EMI SOLUTIONS
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