Glue film and chip encapsulation manufacture process using the glue film

Abstract

A glue film comprises removable substrate, a resin layer and a plurality of arc elastic bodies; wherein, the resin layer which is partially curing resin is in a semi-melting status with viscosity above a first temperature and is in solid condition without viscosity under a second temperature, and the resin layer is adhesively arranged on the substrate; the arc elastic bodies are arranged in the resin layer. The invention additionally provides the packaging procedure of a chip using the glue film.

Description

technical field [0001] The invention relates to an adhesive film, in particular to an adhesive film used in a chip packaging process. Background technique [0002] In the package structure of the chip stack that has been used, as shown in FIG. 1 , the package structure includes a substrate 10 , a lower chip 20 , a dummy die 30 and an upper chip 40 . The lower chip 20 is fixed on the substrate 10 by glue 22, and the upper surface of the lower chip 20 is provided with a plurality of aluminum pads 24 on both sides of the upper surface, which are electrically connected by a plurality of first bonding wires 26. Sexually connected to a plurality of pads 12 of the substrate 10 . The dummy chip 30 is fixed on the lower chip 20 by an adhesive 32 and defines a space required by the first bonding wire 26 , for example, a height above about 5 mils (1 mil=25.4 microns). The upper chip 40 is fixed on the dummy chip 30 by glue 42, and the upper surface 48 of the upper chip 40 is provided...

AI Technical Summary

Problems solved by technology

Although the use of the semi-cured resin can avoid coating each time the die is bonded to shorten the process time, since the semi-cured resin forms a molten state after heating, when the stress of bonding the die is too large, it may not be possible to maintain the first The problem of the height between the chip and the substrate or the second chip makes the first chip contact the bonding wire and thus reduces the process yield

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