Fastener module and heat radiating device having the same

A heat dissipation device and buckle technology, which is applied in the direction of elastic/clamping device, circuit layout on the support structure, cooling/ventilation/heating transformation, etc., can solve problems such as interference, and achieve the effect of low product height

Inactive Publication Date: 2008-06-18
PEGATRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Another object of the present invention is to provide a heat dissipation device to solve the problem that the fastener module easily interferes with the electronic components around the heat sink when the heat sink is assembled on the heat source

Method used

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  • Fastener module and heat radiating device having the same
  • Fastener module and heat radiating device having the same
  • Fastener module and heat radiating device having the same

Examples

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Embodiment Construction

[0028] Figure 2A It is a perspective view of a heat dissipation device in a preferred embodiment of the present invention arranged on a heat source, and Figure 2B for Figure 2A An exploded view of the heat sink and heat source. Please also refer to Figure 2A and Figure 2B The heat dissipation structure 200 of this embodiment is suitable for dissipating heat from a heat source 22 on a circuit board 20 .

[0029]In this embodiment, the fixing module 210 is disposed on the circuit board 20 and surrounds the heat source 22 , and the fixing module 210 has a first fastening portion 212 and a second fastening portion 214 . In addition, the heat sink 220 is, for example, an extruded heat sink or other suitable type of heat sink, and the fastener module 230 straddles the heat sink 220 and is fastened to the first fastening portion 212 and the second fastening portion 212 of the fixing module 210. Buckling part 214 . Hereinafter, this embodiment will describe the clip module ...

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PUM

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Abstract

The invention discloses a buckle module and a heat dissipating device provided with the buckle module, wherein, the heat dissipating device is suitable for dissipating heat for the heat source of the circuit board. The heat dissipating device comprises a fixed module, a radiator and the buckle module, wherein, the fixed module is arranged on the circuit board and around the heat source, the radiator is deployed on the heat source while the buckle module is crossly arranged on the radiator and buckles up the fixed module. The buckle module comprises a body, a blocking part and a pressing structure. One end of the body is suitable for buckling up the fixed module and the body is suitable for pressing the radiator on the heat source. The blocking part is assembled at the other end of the body. One end of the blocking part buckles up the fixed module while the other end is provided with a guiding part which is arranged in a guiding open groove of the pressing structure in a sliding way to lead the pressing structure to be connected with the blocking part.

Description

technical field [0001] The present invention relates to a clip module, and in particular to a clip module and a heat-dissipation apparatus with the clip module. Background technique [0002] In recent years, with the rapid development of technology, the transistors included in various electronic components (such as chipsets) are also getting higher and higher, and the operating temperature of these electronic components is also getting higher and higher. Taking a central processing unit (CPU) of a computer device as an example, since the computing speed of the central processing unit is continuously improved, the heating power of the central processing unit is also continuously rising. In order to prevent temporary or permanent failure of the computer device due to overheating of the CPU, the computer device needs to have sufficient cooling capacity to enable the CPU to operate normally. In order to remove the heat energy generated by the central processing unit during high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/12H05K7/20H01L23/40G06F1/16
Inventor 严坤政
Owner PEGATRON
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