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Wafer retaining device for etching course and method for controlling wafer etching speed

A technology of holding device and etching rate, applied in the field of wafer holding device, which can solve problems such as inability to provide solutions, inconsistent wafer reaction rates, etc.

Inactive Publication Date: 2008-07-30
SAE MAGNETICS (HK) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Looking back at the traditional wafer holding device, it cannot provide a solution to the problem of inconsistent reaction rates on the wafer

Method used

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  • Wafer retaining device for etching course and method for controlling wafer etching speed
  • Wafer retaining device for etching course and method for controlling wafer etching speed
  • Wafer retaining device for etching course and method for controlling wafer etching speed

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Embodiment Construction

[0038] The present invention provides an improved wafer holding device for an etching process to assist in improving the uniformity of wafer etching. Figures 4a-4c and Figures 5a-5e A specific embodiment of the invention is shown. Please refer to Figures 4a-4c , the wafer holding device 400 includes a chassis 402; a top cover 404, which is arranged on the chassis 402, and the top cover 404 has three material holes 401; a bottom plate boss 406, which is located on the chassis 402 and accommodated in the In the material hole 401 of the top cover 404 ; the wafer holder 408 is placed on the boss 406 of the bottom plate and accommodated in the material hole 401 .

[0039] The chassis 402 may be made of stainless steel or aluminum, and the chassis 402 is used to support all other component components, such as the top cover 404 , the bottom plate boss 406 and the wafer holder 408 . The top cover 404 can also be made of aluminum, ceramic material or stainless steel, and the top ...

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Abstract

The invention discloses a wafer holding device used in etching process. The invention comprises a base plate; a top cover arranged on the base plate provided with at least one material hole; a soleplate lug boss arranged on the base plate and in the material hole of the top cover; a wafer jig arranged on the soleplate lug boss and in the material hole. The wafer jig carries the wafer to be etched. The top cover is far from at least a gas dilution groove arranged on the surface of the base plate. The gas dilution groove communicates with the material hole to dilute the byproduct gas produced during etching, thus improving the etching uniformity of the wafer. The invention further discloses a method for controling local etching speed of a wafer. The surface of the wafer and the inner wall of the material hole form a geometric step. The local etching reaction is sped up or slowed down through changing the height of the geometric step, thus improving the etching uniformity of the wafer.

Description

technical field [0001] The present invention relates to an apparatus for manufacturing semiconductor products, and more particularly to an improved wafer holding apparatus for an ion etching process and a method of controlling the local etching rate of a wafer during the etching process, thereby improving the wafer etching process Uniformity. Background technique [0002] As we all know, the current data storage device is mainly a hard disk (Magnetic Hard Disk Drive, HDD). Hard disks use magnetic heads to read and write data on the fly. In order to allow the magnetic head to fly stably and read and write data at high speed, the magnetic head is integrated on the slider (Slider) with an air bearing surface (Air Bear Surface, ABS). The current high-density hard disk requires that the distance between the head and the surface of the disk is only ten nanometers (nm), which requires defining an air bearing surface of extremely fine-sized patterns (Pattern) on the surface of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67H01L21/3065H01L21/311H01L21/3213H01L21/00C23F4/00
Inventor 李昊马洪涛方宏新乔晓峰
Owner SAE MAGNETICS (HK) LTD