Thermally conductive grease

A technology of grease and thermally conductive particles, which is used in the petroleum industry, semiconductor devices, heat exchange materials, etc.

Inactive Publication Date: 2008-08-06
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal or "thermal management" becomes an even greater

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0038] Volumetric thermal conductivity

[0039] Usually, a heat transfer tester from Custom Automation, Inc., Blaine, MN. is used to determine the volumetric thermal conductivity on TCG samples according to ASTM D-5470-01. The heat transfer tester is built according to Proposal Number 3M-102204-01 and includes the following components: Vision system, which can measure the parallelism and gap between copper meter bars, up to 0.010 inches (0.254mm) gap; copper meter Stick, each instrument stick has 5 resistance temperature detector (RTD) sensors; cooler, which is used to cool the cold adjustable pressure block (used to fix the cold instrument stick), with an operating range of -20 to 100 ℃ , And can keep the coolant temperature to + / -0.02℃; 25lbF load cell, installed on the XY micrometer adjustment position table; cold adjustable pressure block (used to fix the cold gauge rod), installed on the load cell ; The hot adjustable pressure block (used to fix the thermal meter stick), us...

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PUM

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Abstract

The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D50) particle size which differs from the other average particle sizes by at least a factor of 5.

Description

[0001] Cross references to related applications [0002] This application is a partial continuation application of US Application No. 11 / 195,953 filed on August 3, 2005, the disclosure of which is incorporated herein by reference in its entirety. Background technique [0003] The present invention relates to thermal interface materials and their use. [0004] The computer industry has been continuously advancing to higher computing power and speed. The size of the microprocessor is being made smaller and smaller to increase the speed of calculation. Therefore, the power flux is increased, and the microprocessor generates more heat per unit area. As the thermal output of the microprocessor increases, heat or "thermal energy management" becomes a greater challenge. [0005] In the industry, one aspect of thermal energy management is called "thermal interface material" or "TIM", which is placed between a heat source (such as a microprocessor) and a heat sink to promote heat transfer...

Claims

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Application Information

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IPC IPC(8): C10M169/00C09K5/14C10M169/06C10N20/06H01L23/373C10N40/14C09K5/10
CPCC10M2215/06C10N2210/03C10M2207/125C10N2210/06C10M2207/30C10M2201/10C10M2201/06C10M2201/041C10M2207/282C10M2215/221C10N2250/10C10M2201/105C10M2207/283C10M2209/11C10N2210/02C10M169/00C10M2219/044C10N2240/20C10M2207/24H01L2924/3011C10N2220/082C10M2209/084C10M169/06H01L2924/0002C10M2201/062C09K5/14H01L23/3737C10N2010/04C10N2010/06C10N2010/12C10N2020/06C10N2040/14C10N2050/10Y10T428/263Y10T428/268Y10T428/31663H01L2924/00C10M125/00C10M125/04C10M125/10
Inventor 贾弗里·T·安德森菲利普·E·肯德尔
Owner 3M INNOVATIVE PROPERTIES CO
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