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Assembly type ground radiation heating installation

A technology for ground radiation and heating devices, which is applied in hot water central heating systems, heating methods, and household heating, etc., can solve the problems of increased manufacturing costs of heating devices, reduced heat dissipation capacity of coils, and difficulty in reaching the temperature in winter. The effect of reducing the laying area, reducing heat energy loss, improving heat transfer efficiency and heat energy utilization rate

Inactive Publication Date: 2008-08-20
顾世安
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The heat insulation board of the above-mentioned combined low-temperature ground radiant heating device is an integral structure, which has the defect of poor heat insulation effect, which causes part of the heat emitted from the coil to be transmitted downward instead of upward to the room. This will result in a certain heat loss
In addition, because the lower part of the coil is located in the lower groove on the upper surface of the heat shield, the ability of the coil to dissipate heat to the room is greatly reduced, which makes it difficult for the indoor temperature to reach the standard in winter, and the method of increasing the laying area has to be adopted. solution, which in turn causes an increase in the manufacturing cost of the heating device

Method used

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Embodiment Construction

[0018] As shown in Figure 1, the assembled floor radiation heating device of the present invention includes several heat insulating boards 3 laid in horizontal rows and vertical columns, and several heat insulating boards 3 are laid in horizontal rows and vertical columns above the heat insulating boards 3. Radiation template 1, Figure 1 only schematically draws two sets of assembled floors, and the actual number of assembled floors can be determined according to the area of ​​the room. Between the heat radiation template 1 and the heat insulation board 3, there is a hot water pipe 5 connected end to end, the two ends of the hot water pipe 5 are connected to the heating device, and the lower surface of the heat insulation board 3 is provided with more than one heat insulation groove 6. The area of ​​the opening of the heat insulation groove 6 is 70% of the area of ​​the lower surface of the heat insulation board 3, and the area of ​​the opening of the heat insulation groove 6 c...

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Abstract

The invention provides an assembly-typed ground irradiation heat supply device, comprising a plurality of heat insulation plates (3) which are arranged in transverse rows and longitudinal lines; a plurality of heat irradiation formworks (1) are arranged above the heat insulation plates (3) in transverse rows and longitudinal lines; hot water pipes (5) are arranged between the heat irradiation formworks (1) and the heat insulation plates (3); the hot water pipe (5) is connected with a heat supply device; the lower half part of the hot water pipe (5) is arranged in a lower concave trough (7) which is arranged on the upper surface of the heat insulation plate (3); the upper half part of the hot water pipe (1) is arranged in an upper concave trough (8) which is arranged on the lower surface of the heat radiation formwork (1); the lower surface of the heat insulation plate (3) is provided with more than one heat insulation troughs (6); the upper surface and the interior of the lower concave trough of the heat insulation plate (3) are attached with a heat transmission plate (2) or a conductive coating layer. The invention aims at providing an assembly-typed ground irradiation heat supply device with the advantages of low cost, light weight, high heat transmission efficiency, little heat loss, and fast construction.

Description

technical field [0001] The invention relates to a heating device arranged under the ground to supply heat indoors. Background technique [0002] The patent number is 200520113310.0, the application date is July 11, 2005, and the authorization announcement date is August 25, 2006. The description of the Chinese invention patent named "Combined Low-temperature Ground Radiant Heating Device" discloses the following technical solutions : [0003] The combined low-temperature ground radiant heating device includes a coil connected to the heating device, and several heat insulation boards laid in horizontal rows and vertical columns. The radiant formwork, the coiled pipe is coiled between the heat radiant formwork and the heat insulation board, the coil pipe has a straight pipe section and an arc pipe section, and the lower half of the straight pipe section of the coil pipe is located in the lower groove on the upper surface of the heat insulation board. The upper half of the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24D3/12F24D19/00
Inventor 顾世安
Owner 顾世安
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