Microphone module group

A technology of microphones and modules, applied in frequency/directional characteristic devices and other directions, can solve the problems of occupying space, reducing assembly efficiency, increasing the cost of microphone arrays, etc., and achieving the effect of reducing difficulty and preventing the reflection of sound waves

Active Publication Date: 2008-08-20
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0002] At present, in general microphone arrays, the microphones are directly soldered to the PCB of the array, which takes up a lot of space on the PCB, increases the volume of the array, and increases the difficulty of assembling the microphone units in the array, and requires a special design of the sound cavity and the microphone. Cooperate with each other to ensure that the sound path of all the sound holes of the microphone is unblocked; this greatly increases the cost of installing the microphone array into the mobile phone and reduces the assembly efficiency

Method used

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Examples

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Embodiment Construction

[0021] as attached figure 1 The microphone module shown in the figure consists of two microphone units 1, a plastic tube 2 with high hardness and a soft rubber cover 3. Both ends of the plastic tube 2 and the rubber cover 3 are open, and multiple microphone units 1 Pack into the plastic cylinder 2, and the rubber sleeve 3 is wrapped on the outside of the plastic cylinder 2. In this embodiment, both the plastic cylinder 2 and the rubber sleeve 3 are approximately cylindrical, and of course they can also be square columns or other column shapes. In this implementation case, the plastic cylinder 2 and the rubber sleeve 3 are independent of each other. Multiple microphone units 1 are first loaded into the plastic cylinder 2, and then the plastic cylinder 2 is loaded into the rubber sleeve 3. At the same time, the plastic cylinder 2 and the rubber sleeve 3 The microphone units can be pre-assembled by injection molding and the like, and the plurality of microphone units 1 are compo...

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Abstract

The invention discloses a microphone module group which includes a plurality of microphone units, a shell for fixing said microphone units. said microphone units are divided into two units, said shell includes a plastic canister with two microphone units are installed inside the plastic canister and a rubber sleeve coated outside said plastic canister; a common acoustic cavity of two microphone units is set between two microphones inside said plastic canister, a voice channel connected with environment and the common acoustic cavity is set on said plastic canister and rubber sleeve; the microphone module group reduces difficulty that the microphone is fit to microphone array, reaches penetration and airtightness of the voice channel, picks up required voice sign efficiently for forming pickup beam of microphone array, and can prevent acoustic reflection in electronic product.

Description

technical field [0001] The invention relates to a microphone module used in a microphone array, which can be directly assembled on a circuit board of the microphone array to form a sound pickup beam for the microphone array to effectively pick up required sound signals. Background technique [0002] At present, the general microphone array is to solder the microphone directly to the PCB of the array, which takes up a lot of space on the PCB, increases the volume of the array, and increases the difficulty of assembling the microphone units in the array, and requires a special design of the sound cavity and the microphone. Cooperate to ensure smooth sound paths of all the sound holes of the microphone; this greatly increases the cost of installing the microphone array into the mobile phone and reduces the assembly efficiency. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a microphone module that takes up little s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/20
Inventor 王显彬祝润兰
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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