Electronic part encapsulation module, external cover and its making method

Abstract

The invention discloses an electronic element encapsulating module, an outer cover and a manufacturing method of the outer cover. The electronic element encapsulating module comprises a loader, at least one electronic element and the outer cover. The loader is provided with a first area and a second area. The electronic element is arranged at the first area of the loader. The outer cover is fixed at the second area of the loader and comprises an inner layer and an outer layer, wherein, the inner layer of the outer cover is made from non-conducting material and an outer layer thereof is made from conducting material; furthermore, the inner layer made from the non-conducting material covers the electronic element and the whole first area of the loader. According to the outer cover of the invention, the inner layer made from the non-conducting material can prevent the outer layer made from the conducting material from contacting all elements on the first area (also called element area) of the loader. When the electronic element encapsulating module is tested, the outer layer made from the conducting material does not contact a passive element and not cause short pass due to the application of pressure and external force.

Description

technical field [0001] The present invention relates to an electronic component packaging module, more particularly to an outer cover of an electronic component packaging module, the inner layer made of non-conductive material can prevent the outer layer made of conductive material from contacting the component area of ​​the carrier All components are used to avoid short circuit, and the outer layer made of conductive material can achieve the effect of metal shielding. Background technique [0002] Referring to FIG. 1 , it shows a wireless communication package module 10 . The wireless communication packaging module 10 includes a substrate 12 , a plurality of active components 14 and passive components 16 and an outer cover 20 . The active components 14 and the passive components 16 are assembled on the substrate 12 through a surface mount technology (SMT) process or an electronic packaging process. The outer cover 20 is fixed on the substrate 12 to cover the active compon...

AI Technical Summary

Problems solved by technology

In addition, the dielectric material layer 145 of the ground arc 170 does not cover the entire component area 112 of the substrate, so the dielectric material layer 145 can only prevent the conductive material layer 160 from contacting the bonding wires 120, but cannot prevent The conductive material layer 160 contacts other components located on the component region 112 of the substrate 110

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